中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
A thermosyphon heat pipe cooler for high power leds cooling

文献类型:期刊论文

作者Li, Ji; Tian, Wenkai; Lv, Lucang
刊名Heat and mass transfer
出版日期2016-08-01
卷号52期号:8页码:1541-1548
ISSN号0947-7411
DOI10.1007/s00231-015-1679-z
通讯作者Li, ji(jili@ucas.ac.cn)
英文摘要Light emitting diode (led) cooling is facing the challenge of high heat flux more seriously with the increase of input power and diode density. the proposed unique thermosyphon heat pipe heat sink is particularly suitable for cooling of high power density led chips and other electronics, which has a heat dissipation potential of up to 280 w within an area of 20 mm x 22 mm (> 60 w/cm(2)) under natural air convection. meanwhile, a thorough visualization investigation was carried out to explore the two phase flow characteristics in the proposed thermosyphon heat pipe. implementing this novel thermosyphon heat pipe heat sink in the cooling of a commercial 100 w led integrated chip, a very low apparent thermal resistance of 0.34 k/w was obtained under natural air convection with the aid of the enhanced boiling heat transfer at the evaporation side and the enhanced natural air convection at the condensation side.
WOS关键词2-PHASE CLOSED THERMOSIPHON
WOS研究方向Thermodynamics ; Mechanics
WOS类目Thermodynamics ; Mechanics
语种英语
WOS记录号WOS:000380113300012
出版者SPRINGER
URI标识http://www.irgrid.ac.cn/handle/1471x/2374503
专题中国科学院大学
通讯作者Li, Ji
作者单位Univ Chinese Acad Sci, Coll Phys, Lab Adv Thermal Management Technol, 19A Yu Quan Lu Rd, Beijing 100049, Peoples R China
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Li, Ji,Tian, Wenkai,Lv, Lucang. A thermosyphon heat pipe cooler for high power leds cooling[J]. Heat and mass transfer,2016,52(8):1541-1548.
APA Li, Ji,Tian, Wenkai,&Lv, Lucang.(2016).A thermosyphon heat pipe cooler for high power leds cooling.Heat and mass transfer,52(8),1541-1548.
MLA Li, Ji,et al."A thermosyphon heat pipe cooler for high power leds cooling".Heat and mass transfer 52.8(2016):1541-1548.

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来源:中国科学院大学

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