Experimental identification of thermal induced warpage in polymer-metal composite films
文献类型：期刊论文
| 作者 | Li, Heng1,2; Zhu, Chunsheng1,2; Xu, Gaowei1; Luo, Le1 |
| 刊名 | Microelectronics reliability
 |
| 出版日期 | 2016-07-01 |
| 卷号 | 62页码:141-147 |
| ISSN号 | 0026-2714 |
| 关键词 | Pi/cu composite Stress evolution Warpage |
| DOI | 10.1016/j.microrel.2016.03.023 |
| 通讯作者 | Luo, le(leluo@mail.sim.ac.cn) |
| 英文摘要 | Composite thick films consisting of multi-layered polymers and metals are widely used in integrated circuits(ic) and its packaging, and it arises intricate stress and warpage problems due to complex inner stress distribution and evolution. the wafer warpage origination and evolution of multi-layered polyimide (pi)/cu composite film is measured in-situ by a multi-beam laser optical sensor (mos) system. it's found that pi has an intricate influence on wafer warpage evolution and cu plastic deformation due to viscoelasticity and glass-transition, and the influence differs in different structures and at different temperatures. nonlinearity of the curvature-temperature curve of the composite occurs at much lower temperature than in single pi or cu film, showing mutual effect of pi and cu. unlike bare or capping pi film that totally stress relaxed at high temperature, bottom pi coated by cu film sustains a medium compressive stress, indicating that cu coating film has restrained stress relaxation of pi. the warpage evolution during heating is different from that during cooling, perhaps due to different deformation mechanism. (c) 2016 elsevier ltd. all rights reserved. |
| WOS关键词 | ELECTROPLATED CU FILMS ; COPPER THIN-FILMS ; STRESS-RELAXATION ; POLYIMIDE ; DEFORMATION ; RELIABILITY ; EVOLUTION ; PACKAGE ; DESIGN |
| WOS研究方向 | Engineering ; Science & Technology - Other Topics ; Physics |
| WOS类目 | Engineering, Electrical & Electronic ; Nanoscience & Nanotechnology ; Physics, Applied |
| 语种 | 英语 |
| 出版者 | PERGAMON-ELSEVIER SCIENCE LTD |
| WOS记录号 | WOS:000379705600019 |
| URI标识 | http://www.irgrid.ac.cn/handle/1471x/2374581 |
| 专题 | 中国科学院大学 |
| 通讯作者 | Luo, Le |
| 作者单位 | 1.Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, Shanghai 200050, Peoples R China 2.Univ Chinese Acad Sci, Beijing 100049, Peoples R China |
| 推荐引用方式 GB/T 7714 | Li, Heng,Zhu, Chunsheng,Xu, Gaowei,et al. Experimental identification of thermal induced warpage in polymer-metal composite films[J]. Microelectronics reliability,2016,62:141-147. |
| APA | Li, Heng,Zhu, Chunsheng,Xu, Gaowei,&Luo, Le.(2016).Experimental identification of thermal induced warpage in polymer-metal composite films.Microelectronics reliability,62,141-147. |
| MLA | Li, Heng,et al."Experimental identification of thermal induced warpage in polymer-metal composite films".Microelectronics reliability 62(2016):141-147. |
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来源：中国科学院大学
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