Influence of polyimide on thermal stress evolution in polyimide/cu thick film composite
文献类型：期刊论文
| 作者 | Li, Heng1,2; Cheng, Gong1,2; Xu, Gaowei1; Luo, Le1 |
| 刊名 | Journal of materials science-materials in electronics
 |
| 出版日期 | 2016-08-01 |
| 卷号 | 27期号:8页码:8325-8331 |
| ISSN号 | 0957-4522 |
| DOI | 10.1007/s10854-016-4841-6 |
| 通讯作者 | Luo, le(leluo@mail.sim.ac.cn) |
| 英文摘要 | Polyimide(pi)/cu composite thick films are widely used in wafer level packaging (wlp), and a common problem is the defects such as void, delamination, crack or wafer warpage induced by thermal stress. compared with traditional rigid substrate/cu/passivation system, pi imposes quite a different boundary constraint on cu, resulting in a special stress evolution, and the corresponding mechanism is far from fully understood. five sets of composites are constructed to investigate the influence of pi on thermal stress evolution in cu film by means of in situ wafer warpage measurement under thermal cycling. together with finite element analyses, it's counterintuitive to find that although pi indeed reduces the stress in cu, it exacerbates overall wafer warpage at room temperature. warpage evolution reveals that composites consisting of substrate/pi/cu sustains a moderate compressive stress while bare pi film is totally stress relaxed at high temperature, indicating that cu and pi restrains stress relaxation reciprocally. it suggests that mutual effect should be considered when evaluating the stress distribution in polymer-metal composite thick films. |
| WOS关键词 | ELECTROPLATED CU FILMS ; COPPER-FILMS ; DIFFUSIONAL CREEP ; RESIDUAL-STRESS ; RELAXATION ; DEFORMATION ; PASSIVATION ; WARPAGE ; STRAIN |
| WOS研究方向 | Engineering ; Materials Science ; Physics |
| WOS类目 | Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter |
| 语种 | 英语 |
| WOS记录号 | WOS:000379803200081 |
| 出版者 | SPRINGER |
| URI标识 | http://www.irgrid.ac.cn/handle/1471x/2375104 |
| 专题 | 中国科学院大学 |
| 通讯作者 | Luo, Le |
| 作者单位 | 1.Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, Shanghai 200050, Peoples R China 2.Univ Chinese Acad Sci, Beijing 100049, Peoples R China |
| 推荐引用方式 GB/T 7714 | Li, Heng,Cheng, Gong,Xu, Gaowei,et al. Influence of polyimide on thermal stress evolution in polyimide/cu thick film composite[J]. Journal of materials science-materials in electronics,2016,27(8):8325-8331. |
| APA | Li, Heng,Cheng, Gong,Xu, Gaowei,&Luo, Le.(2016).Influence of polyimide on thermal stress evolution in polyimide/cu thick film composite.Journal of materials science-materials in electronics,27(8),8325-8331. |
| MLA | Li, Heng,et al."Influence of polyimide on thermal stress evolution in polyimide/cu thick film composite".Journal of materials science-materials in electronics 27.8(2016):8325-8331. |
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来源：中国科学院大学
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