Effects of nh3, o-2, and n-2 co-implantation on cu out-diffusion and antimicrobial properties of copper plasma-implanted polyethylene
文献类型：期刊论文
| 作者 | Zhang, Wei; Ji, Junhui; Zhang, Yihe; Yan, Qing; Kurmaev, E. Z.; Moewes, A.; Zhao, Jun; Chu, Paul K. |
| 刊名 | Applied surface science
 |
| 出版日期 | 2007-09-15 |
| 卷号 | 253期号:22页码:8981-8985 |
| 关键词 | Antimicrobial Plasma immersion ion implantation Copper Polyethylene |
| ISSN号 | 0169-4332 |
| DOI | 10.1016/j.apsusc.2007.05.019 |
| 通讯作者 | Chu, paul k.(paul.chu@cityu.edu.hk) |
| 英文摘要 | Metal antibacterial reagents are effective in the enhancement of the antimicrobial properties of medical polymers. however, incorporation of metal antibacterial reagents into polymers using conventional methods usually results in unstable antimicrobial effects. our previous research demonstrates that plasma immersion ion implantation (piii) can be used to effectively incorporate metal antibacterial reagents such as cu into polyethylene (pe) in the near surface region up to several hundred nanometers without causing noticeable damage to the polymer matrix. in this work, various gases including nh3, o-2, and n-2 were plasma-implanted in concert with cu plasma immersion ion implantation to study the effects of these gas species on the release rate of cu from the substrate. our experimental results reveal that the copper depth profiles are not affected significantly by nh3, o-2, or n-2 co-implantation and these gas elements have similar depth profiles as cu. chemical analyses demonstrate that polar functional c=o, c-o, c-n, c=n, and c n bonds formed in the substrate play an important role in regulating cu out-diffusion. among the three gas species, n-2 shows the best effects in regulating cu out-diffusion and produces the best long term antibacterial properties. the cu retention and out-diffusion mechanism in the ion-implanted polyethylene is described. (c) 2007 elsevier b.v. all rights reserved. |
| WOS关键词 | IMMERSION ION-IMPLANTATION ; POLY VINYL-CHLORIDE ; SURFACE MODIFICATION ; BACTERIAL ADHESION ; STAPHYLOCOCCUS-EPIDERMIDIS ; ANTIBACTERIAL PROPERTIES ; BIOMATERIAL ; INFECTIONS ; TRICLOSAN ; COATINGS |
| WOS研究方向 | Chemistry ; Materials Science ; Physics |
| WOS类目 | Chemistry, Physical ; Materials Science, Coatings & Films ; Physics, Applied ; Physics, Condensed Matter |
| 语种 | 英语 |
| WOS记录号 | WOS:000249484100028 |
| 出版者 | ELSEVIER SCIENCE BV |
| URI标识 | http://www.irgrid.ac.cn/handle/1471x/2380476 |
| 专题 | 中国科学院大学 |
| 通讯作者 | Chu, Paul K. |
| 作者单位 | 1.City Univ Hong Kong, Dept Phys & Mat Sci, Kowloon 100080, Hong Kong, Peoples R China 2.Chinese Acad Sci, Inst Tech Phys & Chem, Beijing 100080, Peoples R China 3.China Univ Geosci, Sch Mat Sci & Technol, Beijing 100083, Peoples R China 4.Chinese Acad Sci, Grad Sch, Beijing 100039, Peoples R China 5.Russian Acad Sci, Inst Met Phys, Ural Div, Ekaterinburg 620041, Russia 6.Univ Saskatchewan, Dept Phys & Engn Phys, Saskatoon, SK S7N 5E2, Canada |
| 推荐引用方式 GB/T 7714 | Zhang, Wei,Ji, Junhui,Zhang, Yihe,et al. Effects of nh3, o-2, and n-2 co-implantation on cu out-diffusion and antimicrobial properties of copper plasma-implanted polyethylene[J]. Applied surface science,2007,253(22):8981-8985. |
| APA | Zhang, Wei.,Ji, Junhui.,Zhang, Yihe.,Yan, Qing.,Kurmaev, E. Z..,...&Chu, Paul K..(2007).Effects of nh3, o-2, and n-2 co-implantation on cu out-diffusion and antimicrobial properties of copper plasma-implanted polyethylene.Applied surface science,253(22),8981-8985. |
| MLA | Zhang, Wei,et al."Effects of nh3, o-2, and n-2 co-implantation on cu out-diffusion and antimicrobial properties of copper plasma-implanted polyethylene".Applied surface science 253.22(2007):8981-8985. |
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来源：中国科学院大学
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