Chemical and physical properties of copper and nitrogen plasma-implanted polyethylene
文献类型：期刊论文
| 作者 | Zhang, Wei; Ji, Junhui; Zhang, Yihe; Yan, Qing; Chu, Paul K. |
| 刊名 | Plasma processes and polymers
 |
| 出版日期 | 2007-02-22 |
| 卷号 | 4期号:2页码:158-164 |
| 关键词 | Copper Plasma immersion ion implantation Polyethylene Xps |
| ISSN号 | 1612-8850 |
| DOI | 10.1002/ppap.200600196 |
| 通讯作者 | Chu, paul k.(paul.chu@cityu.edu.hk) |
| 英文摘要 | Plasma immersion ion implantation (piii) is a new technique used to modify the surface physical and chemical properties of polymers for antibacterial purposes. our previous research work has shown that copper and nitrogen piii can give rise to excellent antibacterial properties on polyethylene (pe) substrates. in this paper, the effects of the piii conditions on the chemical and physical properties of the cu and n plasma-implanted pe are investigated. elemental depth profiles show that cu and n piii results in the formation of c-n, c=n bonds in the surface region, and that the implanted cu does not bond with the polymer matrix elements. a longer piii time increases the concentrations of c=n, c=n and c-n bonds formed in the near-surface region, but the elemental chemical states deeper into the sample remain about the same for different piii time durations. however, if n-piii and cu-piii are not carried out simultaneously, for example, n-piii following cu-piii, the retained cu dose is affected due to nitrogen sputtering, but the cu chemical state is not altered. in addition, more c=n and c=n bonds are formed in the outer surface region. a longer n-piii implantation time further enriches these chemical functional groups. |
| WOS关键词 | IMMERSION ION-IMPLANTATION ; SURFACE MODIFICATION ; BIOMEDICAL APPLICATIONS ; POLYMERS ; IMPROVEMENT ; ADHESION ; FILMS |
| WOS研究方向 | Physics ; Polymer Science |
| WOS类目 | Physics, Applied ; Physics, Fluids & Plasmas ; Physics, Condensed Matter ; Polymer Science |
| 语种 | 英语 |
| WOS记录号 | WOS:000244807300005 |
| 出版者 | WILEY-V C H VERLAG GMBH |
| URI标识 | http://www.irgrid.ac.cn/handle/1471x/2381845 |
| 专题 | 中国科学院大学 |
| 通讯作者 | Chu, Paul K. |
| 作者单位 | 1.City Univ Hong Kong, Dept Phys & Mat Sci, Kowloon, Hong Kong, Peoples R China 2.Chinese Acad Sci, Tech Inst Phys & Chem, Beijing 100101, Peoples R China 3.Chinese Acad Sci, Tech Inst Phys & Chem, Beijing 100101, Peoples R China 4.China Univ Geosci, Sch Mat Sci & Technol, Beijing 100083, Peoples R China 5.Chinese Acad Sci, Grad Sch, Beijing 100039, Peoples R China |
| 推荐引用方式 GB/T 7714 | Zhang, Wei,Ji, Junhui,Zhang, Yihe,et al. Chemical and physical properties of copper and nitrogen plasma-implanted polyethylene[J]. Plasma processes and polymers,2007,4(2):158-164. |
| APA | Zhang, Wei,Ji, Junhui,Zhang, Yihe,Yan, Qing,&Chu, Paul K..(2007).Chemical and physical properties of copper and nitrogen plasma-implanted polyethylene.Plasma processes and polymers,4(2),158-164. |
| MLA | Zhang, Wei,et al."Chemical and physical properties of copper and nitrogen plasma-implanted polyethylene".Plasma processes and polymers 4.2(2007):158-164. |
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来源：中国科学院大学
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