Antimicrobial polyethylene with controlled copper release
文献类型:期刊论文
作者 | Zhang, Wei; Zhang, Yihe; Ji, Junhui; Yan, Qing; Huang, Anping; Chul, Paul K. |
刊名 | Journal of biomedical materials research part a
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出版日期 | 2007-12-01 |
卷号 | 83a期号:3页码:838-844 |
关键词 | Antimicrobial Plasma immersion ion implantation Copper Polyethylene |
ISSN号 | 1549-3296 |
DOI | 10.1002/jbm.a.31436 |
通讯作者 | Chul, paul k.(paul.chu@cityu.edu.hk) |
英文摘要 | Good antiinfection properties of medical polymers, especially those used in artificial organs, are crucial to the minimization of microbial attack in nosocomial treatments. however, medical polymers fabricated by conventional methods usually have unstable and short-lived antimicrobial effects because of unsteady out-diffusion of the antibacterial species from the organic matrix. here, we introduce a dual plasma implantation process to enhance the properties. an inorganic antibacterial element, copper, is introduced into a medical polymer, polyethylene (pe), by means of copper plasma immersion ion implantation (piii) and a subsequent nitrogen piii process is used to regulate the release of the implanted cu. x-ray photoelectron spectroscopy and transmission electron microscopy reveal that a relatively large amount of copper of about 11% is implanted into pe to a depth of several hundred nanometers. chemical analyses confirm that the implanted cu does not bond with the polymer matrix. however, the n-2 plasma treatment produces various functional bonds such as c = n, and c = n which exert appreciable influence on regulating the out-diffusion rate of copper. the large amount of embedded cu, coupled with controlled release of the element to the surface, gives rise to excellent and long-lasting surface antibacterial properties of the plasma-treated polymer. the capability of controlling the release and storing the antibacterial reagent in a buried layer leads to better antimicrobial polymeric materials for medicine. (c) 2007 wiley periodicals, inc. |
WOS关键词 | IMMERSION ION-IMPLANTATION ; POLY VINYL-CHLORIDE ; BACTERIAL ADHESION ; SURFACE MODIFICATION ; TEREPHTHALATE ; INFECTIONS ; MECHANISMS ; RESISTANCE ; CATHETER ; ENERGY |
WOS研究方向 | Engineering ; Materials Science |
WOS类目 | Engineering, Biomedical ; Materials Science, Biomaterials |
语种 | 英语 |
WOS记录号 | WOS:000250742700030 |
出版者 | WILEY-LISS |
URI标识 | http://www.irgrid.ac.cn/handle/1471x/2383125 |
专题 | 中国科学院大学 |
通讯作者 | Chul, Paul K. |
作者单位 | 1.City Univ Hong Kong, Dept Phys & Mat Sci, Kowloon, Hong Kong, Peoples R China 2.Chinese Acad Sci, Tech Inst Phys & Chem, Beijing 100080, Peoples R China 3.Chinese Acad Sci, Grad Sch, Beijing 100039, Peoples R China 4.China Univ Geosci, Sch Mat Sci & Technol, Beijing 100083, Peoples R China |
推荐引用方式 GB/T 7714 | Zhang, Wei,Zhang, Yihe,Ji, Junhui,et al. Antimicrobial polyethylene with controlled copper release[J]. Journal of biomedical materials research part a,2007,83a(3):838-844. |
APA | Zhang, Wei,Zhang, Yihe,Ji, Junhui,Yan, Qing,Huang, Anping,&Chul, Paul K..(2007).Antimicrobial polyethylene with controlled copper release.Journal of biomedical materials research part a,83a(3),838-844. |
MLA | Zhang, Wei,et al."Antimicrobial polyethylene with controlled copper release".Journal of biomedical materials research part a 83a.3(2007):838-844. |
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来源:中国科学院大学
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