Interfacial evolution behavior and reliability evaluation of cosb(3)/ti/mo-cu thermoelectric joints during accelerated thermal aging
文献类型：期刊论文
| 作者 | Zhao, Degang1,2; Li, Xiaoya1; He, Lin3; Jiang, Wan1; Chen, Lidong1 |
| 刊名 | Journal of alloys and compounds
 |
| 出版日期 | 2009-05-27 |
| 卷号 | 477期号:1-2页码:425-431 |
| 关键词 | Thermoelectric Cosb(3)-based device Accelerated thermal aging Interfacial reaction |
| ISSN号 | 0925-8388 |
| DOI | 10.1016/j.jallcom.2008.10.037 |
| 通讯作者 | Chen, lidong(chenlidong@mail.sic.ac.cn) |
| 英文摘要 | Interfacial structure plays a critical role for the reliability of thermoelectric (te) device. this study investigated the interfacial evolution behavior and the reliability of cosb(3)/ti/mo-cu te joints during accelerated thermal aging. after thermal aging, three-layer intermetallic compound (imc) structure was observed at the cosb(3)/ti interface, and eds analysis confirmed that the imc layers were composed of ticosb, tisb(2) and tisb. the total thickness of imc layers increased linearly with the square root of aging time. the growth kinetics of imc layers was studied. the theoretic life of cosb(3)/ti/mo-cu te device was predicted using the growth rate of imc layers. the shear strength of aged cosb(3)/ti/mo-cu te joints was also investigated and the results showed the joints had sufficient strength after aging at 575 degrees c for 720 h. sem showed that, in all the aged samples, the fracture occurred inside of the imc layers, while the fracture occurred in the ti layer or ti/tisb interface in the un-aged samples. (c) 2008 elsevier b.v. all rights reserved. |
| WOS关键词 | SOLDER JOINT ; SN-3.5AG-0.7CU SOLDER ; POWER ; SUBSTRATE ; STRENGTH ; NI |
| WOS研究方向 | Chemistry ; Materials Science ; Metallurgy & Metallurgical Engineering |
| WOS类目 | Chemistry, Physical ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000266386400086 |
| 出版者 | ELSEVIER SCIENCE SA |
| URI标识 | http://www.irgrid.ac.cn/handle/1471x/2394179 |
| 专题 | 中国科学院大学 |
| 通讯作者 | Chen, Lidong |
| 作者单位 | 1.Chinese Acad Sci, Shanghai Inst Ceram, State Key Lab High Performance Ceram & Superfine, Shanghai 200050, Peoples R China 2.Chinese Acad Sci, Grad Univ, Beijing 100049, Peoples R China 3.Corning Inc, Shanghai 201206, Peoples R China |
| 推荐引用方式 GB/T 7714 | Zhao, Degang,Li, Xiaoya,He, Lin,et al. Interfacial evolution behavior and reliability evaluation of cosb(3)/ti/mo-cu thermoelectric joints during accelerated thermal aging[J]. Journal of alloys and compounds,2009,477(1-2):425-431. |
| APA | Zhao, Degang,Li, Xiaoya,He, Lin,Jiang, Wan,&Chen, Lidong.(2009).Interfacial evolution behavior and reliability evaluation of cosb(3)/ti/mo-cu thermoelectric joints during accelerated thermal aging.Journal of alloys and compounds,477(1-2),425-431. |
| MLA | Zhao, Degang,et al."Interfacial evolution behavior and reliability evaluation of cosb(3)/ti/mo-cu thermoelectric joints during accelerated thermal aging".Journal of alloys and compounds 477.1-2(2009):425-431. |
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来源：中国科学院大学
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