中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Synthesis and properties of polyphenylsilicone and polymethylphenylsilicone modified epoxy resins

文献类型:期刊论文

作者Li Yinwen1,2; Shen Minmin1; Huang Huoyang1,2; Ma Yijing1,2; Ha Chengyong1
刊名Acta polymerica sinica
出版日期2009-11-20
期号11页码:1086-1090
关键词Ppms Pmps Epoxy resin Modification Toughness Heat-resistance
ISSN号1000-3304
通讯作者Li yinwen()
英文摘要Silicone modified epoxy resins were prepared by polycondensation of polyphenylmethoxysilicone (ppms) and polymethylphenylsilicone (pmps) with e-20 epoxy resin. oxirane ring and epoxy values were determined by fourier transform infrared (ftir) spectroscopy and hcl/acetone method. the data indicated that silicone oligomers were incorporated into epoxy resin with a random polycondensation and without involving the opening of the oxirane ring in the silicone modified epoxy structure. the influences of silicone contents on the heat-resistant properties of cured silicone modified epoxy resin systems were investigated by differential scanning calorimetry (dsc) and thermogravimetic analysis (tga). the dsc data showed with increasing siloxane content in copolymers the glass transition temperature (t(g)) lowered gradually. but when the mass ratio of epoxy resin to ppms, pmps was 7 : 3, the t(g) was 95.8 degrees c and 88.3 degrees c, higher than those of unmodified epoxy resins systems by 9.0 degrees c and 1.5 degrees c respectively. the tga data indicated that siloxane moiety exerts its thermal stability on the copolymer through dissipation of the heat, thus delaying thermal degradation of the copolymers. when the mass ratio of epoxy resin to ppms, pmps was 7 : 3, the 50% weight loss temperature of degradation (t(d)) was 476.5 degrees c and 487.8 degrees c, higher than those of unmodified epoxy resins systems by 58.3 degrees c and 69.5 degrees c respectively. in contrast to ed-30 cured system, the heat-resistance and toughness of epms-30 cured systems improved more obvious, and its film coatings also showed more excellent filming properties.
WOS研究方向Polymer Science
WOS类目Polymer Science
语种英语
WOS记录号WOS:000272677700002
出版者SCIENCE PRESS
URI标识http://www.irgrid.ac.cn/handle/1471x/2396420
专题中国科学院大学
通讯作者Li Yinwen
作者单位1.Chinese Acad Sci, Guangzhou Inst Chem, Lab Cellulose & Lignocellulos Chem, Guangzhou 510650, Guangdong, Peoples R China
2.Chinese Acad Sci, Grad Sch, Beijing 100039, Peoples R China
推荐引用方式
GB/T 7714
Li Yinwen,Shen Minmin,Huang Huoyang,et al. Synthesis and properties of polyphenylsilicone and polymethylphenylsilicone modified epoxy resins[J]. Acta polymerica sinica,2009(11):1086-1090.
APA Li Yinwen,Shen Minmin,Huang Huoyang,Ma Yijing,&Ha Chengyong.(2009).Synthesis and properties of polyphenylsilicone and polymethylphenylsilicone modified epoxy resins.Acta polymerica sinica(11),1086-1090.
MLA Li Yinwen,et al."Synthesis and properties of polyphenylsilicone and polymethylphenylsilicone modified epoxy resins".Acta polymerica sinica .11(2009):1086-1090.

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来源:中国科学院大学

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