中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Effect of the inalas and ingaas combination strain-reducing layer on 1.3 mu m emission self-assembled inas/gaas quantum dots

文献类型:期刊论文

作者Fang, ZD; Gong, Z; Miao, ZH; Kong, LM; Xu, XH; Ni, HQ; Niu, ZC
刊名Journal of physics d-applied physics
出版日期2004-04-07
卷号37期号:7页码:1012-1016
ISSN号0022-3727
DOI10.1088/0022-3727/37/7/010
通讯作者Fang, zd(zdfang@red.semi.ac.cn)
英文摘要Self-assembled inas quantum dots (qds) with differing deposition thicknesses covered by inxal1-xas (x = 0.2, 0.3) and in0.2ga0.8as combination strain-reducing layers (csrls) were grown by molecular beam epitaxy. their structural and optical properties were investigated by atomic force microscopy and photoluminescence spectroscopy, respectively. the emission peak position of inas qds capped by csrl can reach 1.34 mum at room temperature with a relatively larger energy splitting of 93 mev between the ground and first excited states.
WOS关键词PHOTOLUMINESCENCE ; LASER ; TEMPERATURE ; WAVELENGTH ; SEPARATION ; ISLANDS
WOS研究方向Physics
WOS类目Physics, Applied
语种英语
WOS记录号WOS:000221109800010
出版者IOP PUBLISHING LTD
URI标识http://www.irgrid.ac.cn/handle/1471x/2426201
专题半导体研究所
通讯作者Fang, ZD
作者单位1.Chinese Acad Sci, Inst Semicond, Natl Lab Superlattices & Microstruct, Beijing 100083, Peoples R China
2.Xiamen Univ, Dept Phys, Xiamen 361005, Peoples R China
推荐引用方式
GB/T 7714
Fang, ZD,Gong, Z,Miao, ZH,et al. Effect of the inalas and ingaas combination strain-reducing layer on 1.3 mu m emission self-assembled inas/gaas quantum dots[J]. Journal of physics d-applied physics,2004,37(7):1012-1016.
APA Fang, ZD.,Gong, Z.,Miao, ZH.,Kong, LM.,Xu, XH.,...&Niu, ZC.(2004).Effect of the inalas and ingaas combination strain-reducing layer on 1.3 mu m emission self-assembled inas/gaas quantum dots.Journal of physics d-applied physics,37(7),1012-1016.
MLA Fang, ZD,et al."Effect of the inalas and ingaas combination strain-reducing layer on 1.3 mu m emission self-assembled inas/gaas quantum dots".Journal of physics d-applied physics 37.7(2004):1012-1016.

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来源:半导体研究所

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