中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Optical properties of self-assembled inas/inalas/inp quantum wires with different inas deposited thickness

文献类型:期刊论文

作者Lei, W; Chen, YH; Wang, YL; Huang, XQ; Zhao, C; Liu, JQ; Xu, B; Jin, P; Zeng, YP; Wang, ZG
刊名Journal of crystal growth
出版日期2006
卷号286期号:1页码:23-27
关键词Defects Lateral composition modulation Photoluminescence Molecular beam epitaxy Quantum wires Semiconductor iii-v material
ISSN号0022-0248
DOI10.1016/j.jcrysgro.2005.09.054
通讯作者Lei, w(ahleiwen@red.semi.ac.cn)
英文摘要We report on the photoluminescence (pl) properties of inas/inalas/inp quantum wires (qwrs) with various inas deposited thickness. the pl linewidth of the qwrs decreases with increasing inas deposited thickness due to the different thicknesses of the qwrs and defects in the samples. the defects and lateral composition modulation of the inalas layers play an important role in the temperature-dependent pl properties of the samples. (c) 2005 elsevier b.v. all rights reserved.
WOS关键词DOTS ; HETEROSTRUCTURES ; INALAS/INP(001) ; SPECTROSCOPY ; WAVELENGTH ; INP(001)
WOS研究方向Crystallography ; Materials Science ; Physics
WOS类目Crystallography ; Materials Science, Multidisciplinary ; Physics, Applied
语种英语
WOS记录号WOS:000234135300005
出版者ELSEVIER SCIENCE BV
URI标识http://www.irgrid.ac.cn/handle/1471x/2426582
专题半导体研究所
通讯作者Lei, W
作者单位Chinese Acad Sci, Inst Semicond, Key Lab Semicond Mat Sci, Beijing 100083, Peoples R China
推荐引用方式
GB/T 7714
Lei, W,Chen, YH,Wang, YL,et al. Optical properties of self-assembled inas/inalas/inp quantum wires with different inas deposited thickness[J]. Journal of crystal growth,2006,286(1):23-27.
APA Lei, W.,Chen, YH.,Wang, YL.,Huang, XQ.,Zhao, C.,...&Wang, ZG.(2006).Optical properties of self-assembled inas/inalas/inp quantum wires with different inas deposited thickness.Journal of crystal growth,286(1),23-27.
MLA Lei, W,et al."Optical properties of self-assembled inas/inalas/inp quantum wires with different inas deposited thickness".Journal of crystal growth 286.1(2006):23-27.

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来源:半导体研究所

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