中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Potential frequency bandwidth estimation of to packaging techniques for photodiode modules

文献类型:期刊论文

作者Zhang, S. J.; Zhu, N. H.; Liu, Y.; Xie, L.
刊名Optical and quantum electronics
出版日期2006-06-01
卷号38期号:8页码:675-682
关键词Packaging Photodiode Photodiode module Scattering parameters measurement
ISSN号0306-8919
DOI10.1007/s11082-006-9004-1
通讯作者Zhu, n. h.(nhzhu@red.semi.ac.cn)
英文摘要Scattering parameters of photodiode chip, to header and to packaged module are measured, and the effects of to packaging network on the high-frequency response of photodiode are investigated. based on the analysis, the potential bandwidth of to packaging techniques is estimated from the scattering parameters of the to packaging network. another method for estimating the potential bandwidth from the equivalent circuit for the to packaged photodiode model is also presented. the results obtained using both methods show that the to packaging techniques used in the experiments can potentially achieve a frequency bandwidth of 22 ghz.
WOS关键词LASER
WOS研究方向Engineering ; Optics
WOS类目Engineering, Electrical & Electronic ; Optics
语种英语
WOS记录号WOS:000241687400005
出版者SPRINGER
URI标识http://www.irgrid.ac.cn/handle/1471x/2426637
专题半导体研究所
通讯作者Zhu, N. H.
作者单位Chinese Acad Sci, Inst Semicond, State Key Lab Integrated Optoelect, Beijing 100083, Peoples R China
推荐引用方式
GB/T 7714
Zhang, S. J.,Zhu, N. H.,Liu, Y.,et al. Potential frequency bandwidth estimation of to packaging techniques for photodiode modules[J]. Optical and quantum electronics,2006,38(8):675-682.
APA Zhang, S. J.,Zhu, N. H.,Liu, Y.,&Xie, L..(2006).Potential frequency bandwidth estimation of to packaging techniques for photodiode modules.Optical and quantum electronics,38(8),675-682.
MLA Zhang, S. J.,et al."Potential frequency bandwidth estimation of to packaging techniques for photodiode modules".Optical and quantum electronics 38.8(2006):675-682.

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来源:半导体研究所

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