中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Development of current-based microscopic defect analysis method using optical filling techniques for the defect study on heavily irradiated high-resistivity si sensors/detectors

文献类型:期刊论文

作者Li, Z.; Li, C. J.
刊名Materials science in semiconductor processing
出版日期2006-02-01
卷号9期号:1-3页码:283-287
关键词Dlts Defects Detectors Sensors Current transient
ISSN号1369-8001
DOI10.1016/j.mssp.2006.01.084
通讯作者Li, z.(zhengl@bnl.gov)
英文摘要Current-based microscopic defect analysis method such as current deep level transient spectroscopy (i-dlts) and thermally stimulated current have been developed over the years at brookhaven national laboratory (bnl) for the defect characterizations on heavily irradiated (phi(n) >= 10(13) n/cm(2)) high-resistivity (>= 2 k omega cm) si sensors/detectors. the conventional dlts method using a capacitance transient is not valid on heavily irradiated high-resistivity si sensors/detectors. a new optical filling method, using lasers with various wavelengths, has been applied, which is more efficient and suitable than the traditional voltage-pulse filling. optimum defect-filling schemes and conditions have been suggested for heavily irradiated high-resistivity si sensors/detectors. (c) 2006 published by elsevier ltd.
WOS关键词SILICON DETECTORS
WOS研究方向Engineering ; Materials Science ; Physics
WOS类目Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
语种英语
WOS记录号WOS:000238805900059
出版者ELSEVIER SCI LTD
URI标识http://www.irgrid.ac.cn/handle/1471x/2426701
专题半导体研究所
通讯作者Li, Z.
作者单位1.Brookhaven Natl Lab, Upton, NY 11973 USA
2.Chinese Acad Sci, Inst Semicond, Beijing 100083, Peoples R China
推荐引用方式
GB/T 7714
Li, Z.,Li, C. J.. Development of current-based microscopic defect analysis method using optical filling techniques for the defect study on heavily irradiated high-resistivity si sensors/detectors[J]. Materials science in semiconductor processing,2006,9(1-3):283-287.
APA Li, Z.,&Li, C. J..(2006).Development of current-based microscopic defect analysis method using optical filling techniques for the defect study on heavily irradiated high-resistivity si sensors/detectors.Materials science in semiconductor processing,9(1-3),283-287.
MLA Li, Z.,et al."Development of current-based microscopic defect analysis method using optical filling techniques for the defect study on heavily irradiated high-resistivity si sensors/detectors".Materials science in semiconductor processing 9.1-3(2006):283-287.

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来源:半导体研究所

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