Investigation of a chemically treated inp(100) surface during hydrophilic wafer bonding process
文献类型：期刊论文
| 作者 | Zhao, HQ; Yu, LJ; Huang, YZ |
| 刊名 | Materials science and engineering b-solid state materials for advanced technology
 |
| 出版日期 | 2006-03-15 |
| 卷号 | 128期号:1-3页码:93-97 |
| 关键词 | Surface micro-roughness Contact angle Root-mean-square roughness |
| ISSN号 | 0921-5107 |
| DOI | 10.1016/j.mseb.2005.11.026 |
| 通讯作者 | Zhao, hq(zhggeneral@red.semi.ac.cn) |
| 英文摘要 | Surface micro-roughness, surface chemical properties, and surface wettability are three important aspects of wafer surfaces during a wafer cleaning process, which determine the bonding quality of ordinary direct wafer bonding. in this study, inp wafers are divided into four groups and treated by different chemical processes. subsequently, the characteristics of the treated inp surfaces are carefully studied by x-ray photoelectron spectroscopy (xps), atomic force microscopy (afm), and contact angle measurements. the optimal wafer treatment method for wafer bonding is determined by comparing the results of the processes as a whole. this optimization is later evaluated by a scanning electronic microscope (sem), and the ridge waveguide 1.55 mu m si-based inp/ingaasp multi-quantum-well laser chips are also fabricated. (c) 2005 elsevier b.v. all rights reserved. |
| WOS关键词 | SILICON-WAFERS ; ROUGHNESS ; INP |
| WOS研究方向 | Materials Science ; Physics |
| WOS类目 | Materials Science, Multidisciplinary ; Physics, Condensed Matter |
| 语种 | 英语 |
| WOS记录号 | WOS:000236314500019 |
| 出版者 | ELSEVIER SCIENCE SA |
| URI标识 | http://www.irgrid.ac.cn/handle/1471x/2426802 |
| 专题 | 半导体研究所 |
| 通讯作者 | Zhao, HQ |
| 作者单位 | Chinese Acad Sci, Inst Semicond, State Key Lab Integrated Optoelect, Beijing 100083, Peoples R China |
| 推荐引用方式 GB/T 7714 | Zhao, HQ,Yu, LJ,Huang, YZ. Investigation of a chemically treated inp(100) surface during hydrophilic wafer bonding process[J]. Materials science and engineering b-solid state materials for advanced technology,2006,128(1-3):93-97. |
| APA | Zhao, HQ,Yu, LJ,&Huang, YZ.(2006).Investigation of a chemically treated inp(100) surface during hydrophilic wafer bonding process.Materials science and engineering b-solid state materials for advanced technology,128(1-3),93-97. |
| MLA | Zhao, HQ,et al."Investigation of a chemically treated inp(100) surface during hydrophilic wafer bonding process".Materials science and engineering b-solid state materials for advanced technology 128.1-3(2006):93-97. |
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来源：半导体研究所
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