Silicon bench for passive coupling and packaging of high-frequency optoelectronic devices
文献类型：期刊论文
| 作者 | Yang, H.; Zhu, H. L.; Xie, H. Y.; Zhao, L. J.; Zhou, F.; Wang, W. |
| 刊名 | Ieee transactions on advanced packaging
 |
| 出版日期 | 2007-02-01 |
| 卷号 | 30期号:1页码:34-37 |
| 关键词 | Coplanar waveguide (cpw) Low microwave loss High-frequency Optoelectronic packaging Passive coupling Silicon bench V-groove |
| ISSN号 | 1521-3323 |
| DOI | 10.1109/tadvp.2006.890214 |
| 通讯作者 | Yang, h.() |
| 英文摘要 | Coupling and packaging have become decisive factors in the final performance and cost of high-frequency optoelectronic devices. here, we report the design and successful fabrication of a silicon bench that integrates a v-groove and high-frequency coplanar waveguide (cpw) on the same high-resistivity silicon wafer as an effective optoelectronic packaging solution. |
| WOS研究方向 | Engineering ; Materials Science |
| WOS类目 | Engineering, Manufacturing ; Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary |
| 语种 | 英语 |
| WOS记录号 | WOS:000244191100005 |
| 出版者 | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC |
| URI标识 | http://www.irgrid.ac.cn/handle/1471x/2427069 |
| 专题 | 半导体研究所 |
| 通讯作者 | Yang, H. |
| 作者单位 | Chinese Acad Sci, Inst Semicond, Optoelect R&D Ctr, Beijing 100864, Peoples R China |
| 推荐引用方式 GB/T 7714 | Yang, H.,Zhu, H. L.,Xie, H. Y.,et al. Silicon bench for passive coupling and packaging of high-frequency optoelectronic devices[J]. Ieee transactions on advanced packaging,2007,30(1):34-37. |
| APA | Yang, H.,Zhu, H. L.,Xie, H. Y.,Zhao, L. J.,Zhou, F.,&Wang, W..(2007).Silicon bench for passive coupling and packaging of high-frequency optoelectronic devices.Ieee transactions on advanced packaging,30(1),34-37. |
| MLA | Yang, H.,et al."Silicon bench for passive coupling and packaging of high-frequency optoelectronic devices".Ieee transactions on advanced packaging 30.1(2007):34-37. |
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来源：半导体研究所
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