Simulation of light coupling enhancement and localization of transmission field via subwavelength metallic gratings
文献类型:期刊论文
作者 | Bai Wen-Li1; Guo Bao-Shan1; Cai Li-Kang1; Gan Qiao-Qiang2; Song Guo-Feng1 |
刊名 | Acta physica sinica
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出版日期 | 2009-11-01 |
卷号 | 58期号:11页码:8021-8026 |
关键词 | Surface plasmon Nano grating Thin film solar cell Transmission enhancement |
ISSN号 | 1000-3290 |
通讯作者 | Song guo-feng(sgf@semi.ac.cn) |
英文摘要 | Surface plasmons(sps) generated in nano metallic gratings on medium layer can greatly enhance the transmission field through the metallic gratings. the enhancement effect is achieved from lambda = 500 nm to near-infrared domain. the enhancement rate is about 110 % at the wavelength of about 6 10 nm and about 180 % at lambda = 700 nm and 740 nm where most kinds of thin film solar cells have a high spectral response. these structures should provide a promising way to increase the coupling efficiency of thin film solar cells and optical detectors of different wavelength response. |
WOS关键词 | OPTICAL-TRANSMISSION |
WOS研究方向 | Physics |
WOS类目 | Physics, Multidisciplinary |
语种 | 英语 |
WOS记录号 | WOS:000271835200100 |
出版者 | CHINESE PHYSICAL SOC |
URI标识 | http://www.irgrid.ac.cn/handle/1471x/2427616 |
专题 | 半导体研究所 |
通讯作者 | Song Guo-Feng |
作者单位 | 1.Chinese Acad Sci, Inst Semicond, Beijing 100083, Peoples R China 2.Lehigh Univ, Dept Elect & Comp Engn, Bethlehem, PA 18015 USA |
推荐引用方式 GB/T 7714 | Bai Wen-Li,Guo Bao-Shan,Cai Li-Kang,et al. Simulation of light coupling enhancement and localization of transmission field via subwavelength metallic gratings[J]. Acta physica sinica,2009,58(11):8021-8026. |
APA | Bai Wen-Li,Guo Bao-Shan,Cai Li-Kang,Gan Qiao-Qiang,&Song Guo-Feng.(2009).Simulation of light coupling enhancement and localization of transmission field via subwavelength metallic gratings.Acta physica sinica,58(11),8021-8026. |
MLA | Bai Wen-Li,et al."Simulation of light coupling enhancement and localization of transmission field via subwavelength metallic gratings".Acta physica sinica 58.11(2009):8021-8026. |
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来源:半导体研究所
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