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Chinese Academy of Sciences Institutional Repositories Grid
Fbg pressure sensor based on the double shell cylinder with temperature compensation

文献类型:期刊论文

作者Zhang, Wentao; Li, Fang; Liu, Yuliang
刊名Measurement
出版日期2009-04-01
卷号42期号:3页码:408-411
关键词Fiber bragg grating Temperature compensation Pressure sensor
ISSN号0263-2241
DOI10.1016/j.measurement.2008.08.007
通讯作者Zhang, wentao(zwt800208@163.com)
英文摘要A novel fiber bragg grating (fbg) pressure sensor based on the double shell cylinder with temperature compensation is presented. in the sensing scheme, a sensing fbg is affixed in the tangential direction on the outer surface of the inner cylinder, and another fbg is affixed in the axial direction to compensate the temperature fluctuation. based on the theory of elasticity, the theoretical analysis of the strain distribution of the sensing shell is presented. experiments are carried out to test the performance of the sensor. a pressure sensitivity of 0.0937 nm/mpa has been achieved. the experimental results also demonstrate that the two fbgs have the same temperature sensitivity, which can be utilized to compensate the temperature induced wavelength shift during the pressure measurement. (c) 2008 elsevier ltd. all rights reserved.
WOS研究方向Engineering ; Instruments & Instrumentation
WOS类目Engineering, Multidisciplinary ; Instruments & Instrumentation
语种英语
WOS记录号WOS:000264034900009
出版者ELSEVIER SCI LTD
URI标识http://www.irgrid.ac.cn/handle/1471x/2427681
专题半导体研究所
通讯作者Zhang, Wentao
作者单位Chinese Acad Sci, Inst Semicond, State Key Lab Integrated Optoelect, Beijing 100083, Peoples R China
推荐引用方式
GB/T 7714
Zhang, Wentao,Li, Fang,Liu, Yuliang. Fbg pressure sensor based on the double shell cylinder with temperature compensation[J]. Measurement,2009,42(3):408-411.
APA Zhang, Wentao,Li, Fang,&Liu, Yuliang.(2009).Fbg pressure sensor based on the double shell cylinder with temperature compensation.Measurement,42(3),408-411.
MLA Zhang, Wentao,et al."Fbg pressure sensor based on the double shell cylinder with temperature compensation".Measurement 42.3(2009):408-411.

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来源:半导体研究所

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