中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Structural evaluation of polycrystalline silicon thin films by hot-wire-assisted pecvd

文献类型:期刊论文

作者Feng, Y; Zhu, M; Liu, F; Liu, J; Han, H; Han, Y
刊名Thin solid films
出版日期2001-09-03
卷号395期号:1-2页码:213-216
关键词Poly-si Structure Hot-wire Plasma-enhanced chemical vapor deposition (pecvd)
ISSN号0040-6090
通讯作者Zhu, m()
英文摘要Tungsten wires were introduced into a plasma-enhanced chemical vapor deposition (pecvd) system as a catalyzer: we name this technique 'hot-wire-assisted pecvd' (hw-pecvd). under constant deposition pressure (p(g)), gas flow ratio and catalyzer position, the effects of the hot wire temperature (t-f) on the structural properties of the poly-si films have been characterized by x-ray diffraction (xrd), raman scattering and fourier-transform infrared (ftir) spectroscopy. compared with conventional pecvd, the grain size, crystalline volume fraction (x-e) and deposition rate were all enhanced when a high t-f was used. the best poly-si film exhibits a preferential (220) orientation, with a full width at half-maximum (fwhm) of 0.2 degrees. the si-si to peak of the raman scattering spectrum is located at 519.8 cm(-1) with a fwhm of 7.1 cm(-1). the x-c is 0.93. these improvements are mainly the result of promotion of the dissociation of sih4 and an increase in the atomic h concentration in the gas phase. (c) 2001 elsevier science b.v. all rights reserved.
WOS关键词CHEMICAL-VAPOR-DEPOSITION ; MICROCRYSTALLINE SILICON ; HYDROGEN
WOS研究方向Materials Science ; Physics
WOS类目Materials Science, Multidisciplinary ; Materials Science, Coatings & Films ; Physics, Applied ; Physics, Condensed Matter
语种英语
WOS记录号WOS:000171625000044
出版者ELSEVIER SCIENCE SA
URI标识http://www.irgrid.ac.cn/handle/1471x/2429057
专题半导体研究所
通讯作者Zhu, M
作者单位1.Chinese Acad Sci, Grad Sch, Dept Phys, Beijing 100039, Peoples R China
2.Chinese Acad Sci, Lab Semicond Mat Sci, Beijing 100039, Peoples R China
3.Chinese Acad Sci, Inst Semicond, Natl Lab Superlattices & Microstruct, Beijing 100084, Peoples R China
推荐引用方式
GB/T 7714
Feng, Y,Zhu, M,Liu, F,et al. Structural evaluation of polycrystalline silicon thin films by hot-wire-assisted pecvd[J]. Thin solid films,2001,395(1-2):213-216.
APA Feng, Y,Zhu, M,Liu, F,Liu, J,Han, H,&Han, Y.(2001).Structural evaluation of polycrystalline silicon thin films by hot-wire-assisted pecvd.Thin solid films,395(1-2),213-216.
MLA Feng, Y,et al."Structural evaluation of polycrystalline silicon thin films by hot-wire-assisted pecvd".Thin solid films 395.1-2(2001):213-216.

入库方式: iSwitch采集

来源:半导体研究所

浏览0
下载0
收藏0
其他版本

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。