Residual Stress And Deformation Analysis Of Anodic Bonded Multi-Layer Of Glass And Aluminum
文献类型：期刊论文
| 作者 | Liu CR; Lu XY ; Yang ZY(杨振宇); Meng QS
|
| 刊名 | International Journal of Nonlinear Sciences and Numerical Simulation
 |
| 出版日期 | 2008 |
| 页码 | 347-353 |
| 通讯作者邮箱 | mengqingsen@263.net |
| 关键词 | Anodic Bonding Mems Aluminum Glass Residual Stress Finite Element |
| ISSN号 | 1565-1339 |
| 通讯作者 | Meng, QS (reprint author), Taiyuan Univ Technol, China Educ Minist & Shanxi Provence, Key Lab Adv Mat & Interface Sci, Taiyuan 030024, Peoples R China. |
| 中文摘要 | The bonding of glass wafer to aluminum foils in multi-layer assemblies was made by the common anodic bonding process. The bonding was performed at temperatures in the range 350-450 degrees C and with an applied voltage in the range 400-700 V under a pressure of 0.05 MPa. Residual stress and deformation in samples of two-layer (aluminum/glass) and three-layer (glass/aluminum/glass) were analyzed by nonlinear finite element simulation software MARC. The stress and strain varying with cooling time were obtained. The analyzed results show that deformation of the three-layer sample is significantly smaller than that of the two-layer sample, because of the symmetric structure of the three-layer sample. This has an important advantage in MEMS fabrication. The maximum equivalent stresses locate in the transition layer in both samples, which will become weakness in bonded sample. |
| 类目[WOS] | Engineering, Multidisciplinary ; Mathematics, Applied ; Mechanics ; Physics, Mathematical |
| 研究领域[WOS] | Engineering ; Mathematics ; Mechanics ; Physics |
| 收录类别 | SCI |
| 语种 | 英语 |
| WOS记录号 | WOS:000260106100006 |
| 公开日期 | 2009-08-03 ; 2009-09-14 |
| 源URL | [http://dspace.imech.ac.cn/handle/311007/25878]  |
| 专题 | 力学研究所_力学所知识产出(1956-2008) |
| 推荐引用方式 GB/T 7714 | Liu CR,Lu XY,Yang ZY,et al. Residual Stress And Deformation Analysis Of Anodic Bonded Multi-Layer Of Glass And Aluminum[J]. International Journal of Nonlinear Sciences and Numerical Simulation,2008:347-353. |
| APA | Liu CR,Lu XY,杨振宇,&Meng QS.(2008).Residual Stress And Deformation Analysis Of Anodic Bonded Multi-Layer Of Glass And Aluminum.International Journal of Nonlinear Sciences and Numerical Simulation,347-353. |
| MLA | Liu CR,et al."Residual Stress And Deformation Analysis Of Anodic Bonded Multi-Layer Of Glass And Aluminum".International Journal of Nonlinear Sciences and Numerical Simulation (2008):347-353. |
入库方式： OAI收割
来源：力学研究所
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