Tensile Tests Of Micro Anchors Anodically Bonded Between Pyrex Glass And Aluminum Thin Film Coated On Silicon Wafer
文献类型：期刊论文
| 作者 | Hu YQ(胡宇群) ; Zhao YP(赵亚溥); Yu TX(余同希)
|
| 刊名 | Microelectronics Reliability
 |
| 出版日期 | 2008 |
| 页码 | 1720-1723 |
| 通讯作者邮箱 | yzhao@imech.ac.cn |
| 关键词 | On-Insulator Adhesion |
| ISSN号 | 0026-2714 |
| 通讯作者 | Zhao, YP (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China. |
| 中文摘要 | Micro anchor is a kind of typical structures in micro/nano electromechanical systems (MEMS/NEMS), and it can be made by anodic bonding process, with thin films of metal or alloy as an intermediate layer. At the relative low temperature and voltage, specimens with actually sized micro anchor structures were anodically bonded using Pyrex 7740 glass and patterned crystalline silicon chips coated with aluminum thin film with a thickness comprised between 50 nm and 230 nm. To evaluate the bonding quality, tensile pulling tests have been finished with newly designed flexible fixtures for these specimens. The experimental results exhibit that the bonding tensile strength increases with the bonding temperature and voltage, but it decreases with the increase of the thickness of Al intermediate layer. This kind of thickness effect of the intermediate layer was not mentioned in the literature on anodic bonding. (C) 2008 Elsevier Ltd. All rights reserved. |
| 类目[WOS] | Engineering, Electrical & Electronic ; Nanoscience & Nanotechnology ; Physics, Applied |
| 研究领域[WOS] | Engineering ; Science & Technology - Other Topics ; Physics |
| 关键词[WOS] | ON-INSULATOR ; ADHESION |
| 收录类别 | SCI |
| 语种 | 英语 |
| WOS记录号 | WOS:000259844900016 |
| 公开日期 | 2009-08-03 ; 2009-09-14 |
| 源URL | [http://dspace.imech.ac.cn/handle/311007/25884]  |
| 专题 | 力学研究所_力学所知识产出(1956-2008) |
| 推荐引用方式 GB/T 7714 | Hu YQ,Zhao YP,Yu TX. Tensile Tests Of Micro Anchors Anodically Bonded Between Pyrex Glass And Aluminum Thin Film Coated On Silicon Wafer[J]. Microelectronics Reliability,2008:1720-1723. |
| APA | 胡宇群,赵亚溥,&余同希.(2008).Tensile Tests Of Micro Anchors Anodically Bonded Between Pyrex Glass And Aluminum Thin Film Coated On Silicon Wafer.Microelectronics Reliability,1720-1723. |
| MLA | 胡宇群,et al."Tensile Tests Of Micro Anchors Anodically Bonded Between Pyrex Glass And Aluminum Thin Film Coated On Silicon Wafer".Microelectronics Reliability (2008):1720-1723. |
入库方式： OAI收割
来源：力学研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。