Design of UV LED illumination system for direct imaging lithography
文献类型:会议论文
作者 | Jiang, Haibo![]() ![]() ![]() ![]() ![]() |
出版日期 | 2018 |
会议日期 | October 11, 2018 - October 13, 2018 |
会议地点 | Beijing, China |
DOI | 10.1117/12.2500955 |
英文摘要 | UV LED, which is used as the illumination source in the direct imaging (DI) exposure equipment, has the advantages of rich wavelengths and low cost. It has a good application prospect in the field of printed circuit board (PCB) manufacturing. An optical structure of the illumination system for DI lithography, which combines Kohler illumination and double telecentric imaging, is presented. First, the shape of the spot matched with Digital Micromirror Device (DMD) is obtained by setting an aperture at the imaging plane of LED chips to filter out the stray light. Then the aperture is imaged onto the working plane of DMD by the posterior double telecentric lens. The uniform illumination spot without stray light can be achieved on the DMD in the end. In this design, fly eyes are not needed, and the stray light on the DMD surface caused by light outside the effective angle of the LED can be filtered out completely. Based on this idea, a lithographic illumination system with the numerical aperture (NA) of 0.1 is designed and fabricated for 0.95 inch DMD. According to experimental measurements, the effective illumination power is up to 10W, and the illuminance uniformity is more than 85%, which meet the lighting requirements of direct imaging lithography equipment used in PCB manufacturing. © 2018 SPIE. |
会议录 | Optical Design and Testing VIII 2018
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语种 | 英语 |
电子版国际标准刊号 | 1996756X |
ISSN号 | 0277786X |
源URL | [http://119.78.100.138/handle/2HOD01W0/7964] ![]() |
专题 | 集成光电技术研究中心 |
作者单位 | Optoelectronic Technology Integration Research Center, Chongqing Institute of Green and Intelligent Technology, Chinese Academy of Sciences, Chongqing; 400714, China |
推荐引用方式 GB/T 7714 | Jiang, Haibo,Sun, Xiuhui,Yang, Ruofu,et al. Design of UV LED illumination system for direct imaging lithography[C]. 见:. Beijing, China. October 11, 2018 - October 13, 2018. |
入库方式: OAI收割
来源:重庆绿色智能技术研究院
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