Superhydrophobicity-Mediated Electrochemical Reaction Along the Solid-Liquid-Gas Triphase Interface: EdgeGrowth of Gold Architectures
文献类型:期刊论文
作者 | Wu, Yuchen1; Liu, Kesong2; Su, Bin1; Jiang, Lei1,2 |
刊名 | ADVANCED MATERIALS
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出版日期 | 2014-02-01 |
卷号 | 26期号:7页码:1124-1128 |
关键词 | Superhydrophobicity Electrochemistry Micropillars Gold |
ISSN号 | 0935-9648 |
DOI | 10.1002/adma.201304062 |
语种 | 英语 |
WOS记录号 | WOS:000331909800019 |
出版者 | WILEY-V C H VERLAG GMBH |
源URL | [http://ir.iccas.ac.cn/handle/121111/52799] ![]() |
专题 | 中国科学院化学研究所 |
通讯作者 | Su, Bin |
作者单位 | 1.ICCAS, BNLMS, Key Lab Organ Solids, Beijing 100190, Peoples R China 2.Beihang Univ, Sch Chem & Environm, Beijing 100191, Peoples R China |
推荐引用方式 GB/T 7714 | Wu, Yuchen,Liu, Kesong,Su, Bin,et al. Superhydrophobicity-Mediated Electrochemical Reaction Along the Solid-Liquid-Gas Triphase Interface: EdgeGrowth of Gold Architectures[J]. ADVANCED MATERIALS,2014,26(7):1124-1128. |
APA | Wu, Yuchen,Liu, Kesong,Su, Bin,&Jiang, Lei.(2014).Superhydrophobicity-Mediated Electrochemical Reaction Along the Solid-Liquid-Gas Triphase Interface: EdgeGrowth of Gold Architectures.ADVANCED MATERIALS,26(7),1124-1128. |
MLA | Wu, Yuchen,et al."Superhydrophobicity-Mediated Electrochemical Reaction Along the Solid-Liquid-Gas Triphase Interface: EdgeGrowth of Gold Architectures".ADVANCED MATERIALS 26.7(2014):1124-1128. |
入库方式: OAI收割
来源:化学研究所
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