中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Solvent-assisted polymer-bonding lithography

文献类型:期刊论文

作者Luan, SF; Xing, RB; Wang, Z; Yu, XH; Han, YC
刊名JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
出版日期2005
卷号23期号:1页码:236-241
ISSN号1071-1023
英文摘要Solvent-assisted polymer-bonding lithography based on surface adhesion to the transfer pattern between the polymer films is presented. Its primary feature is the application of solvent vapor to enhance the adhesion between the polymers on the elastomeric polydimethylsiloxane mold and the substrate. When the mold is lifted off, the pattern is transferred to the substrate, assuming that the work of adhesion of the polymer/mold and the polymer/substrate was permitted. Solvent-assisted polymer-bonding lithography can fabricate micrometer and submicron patterns between the same and different polymers on the planar and nonplanar substrates at low temperatures and pressures. (C) 2005 American Vacuum Society.
语种英语
WOS记录号WOS:000227300900043
出版者A V S AMER INST PHYSICS
源URL[http://ir.iccas.ac.cn/handle/121111/56567]  
专题中国科学院化学研究所
通讯作者Han, YC
作者单位Chinese Acad Sci, Changchun Inst Appl Chem, State Key Lab Polymer Phys & Chem, Changchun 130022, Peoples R China
推荐引用方式
GB/T 7714
Luan, SF,Xing, RB,Wang, Z,et al. Solvent-assisted polymer-bonding lithography[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B,2005,23(1):236-241.
APA Luan, SF,Xing, RB,Wang, Z,Yu, XH,&Han, YC.(2005).Solvent-assisted polymer-bonding lithography.JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B,23(1),236-241.
MLA Luan, SF,et al."Solvent-assisted polymer-bonding lithography".JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 23.1(2005):236-241.

入库方式: OAI收割

来源:化学研究所

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