中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Study on the preparation and properties of copper nitride thin films

文献类型:期刊论文

作者Yue, GH; Yan, PX; Wang, J
刊名JOURNAL OF CRYSTAL GROWTH
出版日期2005-02-01
卷号274期号:3-4页码:464-468
关键词Optical Recording Thermal Stability Copper Nitride Thin Film
ISSN号0022-0248
DOI10.1016/j.jcrysgro.2004.10.032
英文摘要Copper nitride (Cu3N) thin films were prepared on glass substrates by reactive radio-frequency (RF) magnetron sputtering tinder different nitrogen flow rate. The thermal stability of the Cu3N films was investigated through vacuum annealing treatment at different temperature. X-ray diffraction, scanning electron microscopy and near-normal reflectance spectra were employed to characterize the films. The deposited Cu3N films take on a different preferred orientation, which changed from (1 1 1) to (1 0 0) with increase of N-2 ratio. The grains size of thin films can become small when the N-2 ratio increases. The Cu3N phase can completely decompose into Cu and N-2 through vacuum annealing treatment at a temperature of 200degreesC. The reflectance of as-deposited Cu3N films is quite different from decomposed films. (C) 2004 Elsevier B.V. All rights reserved.
语种英语
WOS记录号WOS:000226704900021
出版者ELSEVIER SCIENCE BV
源URL[http://ir.iccas.ac.cn/handle/121111/57065]  
专题中国科学院化学研究所
通讯作者Yan, PX
作者单位1.Lanzhou Univ, Inst Plasma & Met Mat, Lanzhou 730000, Peoples R China
2.Chinese Acad Sci, Inst Chem & Phys, Key Lab Solid Lubricat, Lanzhou 730000, Peoples R China
推荐引用方式
GB/T 7714
Yue, GH,Yan, PX,Wang, J. Study on the preparation and properties of copper nitride thin films[J]. JOURNAL OF CRYSTAL GROWTH,2005,274(3-4):464-468.
APA Yue, GH,Yan, PX,&Wang, J.(2005).Study on the preparation and properties of copper nitride thin films.JOURNAL OF CRYSTAL GROWTH,274(3-4),464-468.
MLA Yue, GH,et al."Study on the preparation and properties of copper nitride thin films".JOURNAL OF CRYSTAL GROWTH 274.3-4(2005):464-468.

入库方式: OAI收割

来源:化学研究所

浏览0
下载0
收藏0
其他版本

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。