Micro-phase saeparation in epoxy resin waterborne particles during curing process
文献类型：期刊论文
| 作者 | Liu, XY; Qiu, D; Guo, ML; Yang, ZZ |
| 刊名 | CHINESE JOURNAL OF POLYMER SCIENCE
 |
| 出版日期 | 2005-09-01 |
| 卷号 | 23期号:5页码:561-566 |
| 关键词 | Curing Process Phenolic Epoxy Resin Waterborne Dispersions Micro-phase Separation Core/shell Structure |
| ISSN号 | 0256-7679 |
| 英文摘要 | Sub-micron sized phenolic epoxy resin waterborne particles were prepared by phase inversion emulsification. Micro-phase separation occurred during the curing process at high temperature. The as-prepared samples possessed one glass transition temperature (T-g) and two exothermal processes during DSC heating scannings. After being thermally treated above the exothermal peak temperature, they possessed two glass transition temperatures with the disappearance of exothermal peaks, whilst a core/shell structure was formed. This was likely related with the outward diffusion of reactive oligomers to the outer layer of particles. |
| 语种 | 英语 |
| WOS记录号 | WOS:000232362300014 |
| 出版者 | WORLD SCIENTIFIC PUBL CO PTE LTD |
| 源URL | [http://ir.iccas.ac.cn/handle/121111/57213]  |
| 专题 | 中国科学院化学研究所 |
| 通讯作者 | Guo, ML |
| 作者单位 | 1.Chinese Acad Sci, Inst Chem, State Key Lab Polymer Phys & Chem, Beijing 100080, Peoples R China 2.BeiHang Univ, Sch Mat Sci & Engn, Beijing 100083, Peoples R China |
| 推荐引用方式 GB/T 7714 | Liu, XY,Qiu, D,Guo, ML,et al. Micro-phase saeparation in epoxy resin waterborne particles during curing process[J]. CHINESE JOURNAL OF POLYMER SCIENCE,2005,23(5):561-566. |
| APA | Liu, XY,Qiu, D,Guo, ML,&Yang, ZZ.(2005).Micro-phase saeparation in epoxy resin waterborne particles during curing process.CHINESE JOURNAL OF POLYMER SCIENCE,23(5),561-566. |
| MLA | Liu, XY,et al."Micro-phase saeparation in epoxy resin waterborne particles during curing process".CHINESE JOURNAL OF POLYMER SCIENCE 23.5(2005):561-566. |
入库方式： OAI收割
来源：化学研究所
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