Morphology and thermal stability of Ti-doped copper nitride films
文献类型：期刊论文
| 作者 | Fan, Xiaoyan; Wu, Zhiguo; Li, Huajun; Geng, Baisong; Li, Chun; Yan, Pengxun |
| 刊名 | JOURNAL OF PHYSICS D-APPLIED PHYSICS
 |
| 出版日期 | 2007-06-07 |
| 卷号 | 40期号:11页码:3430-3435 |
| ISSN号 | 0022-3727 |
| DOI | 10.1088/0022-3727/40/11/025 |
| 英文摘要 | A weakly Ti-doped copper nitride ( Cu3N) film was prepared by cylindrical magnetron sputtering. The XPS results indicate that Ti atoms do not substitute for the Cu atoms but probably locate at the grain boundaries. The columnar grains size is about half of that of the undoped Cu3N film and the surface is smoother. For weakly Ti-doped Cu3N films, a dense layer appears on top of the columnar crystals. The RMS of the Cu film formed by annealing of the weakly Ti-doped Cu3N film is more than twice larger than that of the film before annealing. Compared with the undoped Cu3N film, it possesses fine thermal stability both in vacuum and in atmosphere. |
| 语种 | 英语 |
| WOS记录号 | WOS:000246577500026 |
| 出版者 | IOP PUBLISHING LTD |
| 源URL | [http://ir.iccas.ac.cn/handle/121111/61355]  |
| 专题 | 中国科学院化学研究所 |
| 通讯作者 | Yan, Pengxun |
| 作者单位 | 1.Chinese Acad Sci, Inst Chem & Phys, Key Lab Solid Lubricat, Lanzhou 730000, Peoples R China 2.Lanzhou Univ, Sch Phys Sci & Technol, Lanzhou 730000, Peoples R China |
| 推荐引用方式 GB/T 7714 | Fan, Xiaoyan,Wu, Zhiguo,Li, Huajun,et al. Morphology and thermal stability of Ti-doped copper nitride films[J]. JOURNAL OF PHYSICS D-APPLIED PHYSICS,2007,40(11):3430-3435. |
| APA | Fan, Xiaoyan,Wu, Zhiguo,Li, Huajun,Geng, Baisong,Li, Chun,&Yan, Pengxun.(2007).Morphology and thermal stability of Ti-doped copper nitride films.JOURNAL OF PHYSICS D-APPLIED PHYSICS,40(11),3430-3435. |
| MLA | Fan, Xiaoyan,et al."Morphology and thermal stability of Ti-doped copper nitride films".JOURNAL OF PHYSICS D-APPLIED PHYSICS 40.11(2007):3430-3435. |
入库方式： OAI收割
来源：化学研究所
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