Glass wafers bonding via Diels-Alder reaction at mild temperature
文献类型：期刊论文
| 作者 | Zhang, Minjie1,2; Zhao, Hanying1; Gao, Lianxun1 |
| 刊名 | SENSORS AND ACTUATORS A-PHYSICAL
 |
| 出版日期 | 2008-01-15 |
| 卷号 | 141期号:1页码:213-216 |
| 关键词 | Glass Wafers Bonding Diels-alder Reaction Mild Temperature |
| ISSN号 | 0924-4247 |
| DOI | 10.1016/j.sna.2007.08.001 |
| 英文摘要 | In this paper, we introduced a novel bonding method of glass wafers by Diels-Alder reaction at mild temperature. After standard hydroxylization and aminosilylation, two wafers were modified by 2-furaldehyde and maleic anhydride, respectively. Then they were brought into close contact and tightly held with a clamping fixture. A strong bonding could be achieved by annealing for 5 h at 200 degrees C. Bonding strength is as high as 1.78 MPa and sufficient for most application of microfluidic chips. This bonding process has the advantages of simple operation and good smoothness of the wafer surface. Mild temperature can prevent the channel of microfluidic chip distorted or collapse and shorten the cooling time. (c) 2007 Elsevier B.V. All rights reserved. |
| 语种 | 英语 |
| WOS记录号 | WOS:000253390400028 |
| 出版者 | ELSEVIER SCIENCE SA |
| 源URL | [http://ir.iccas.ac.cn/handle/121111/65037]  |
| 专题 | 中国科学院化学研究所 |
| 通讯作者 | Gao, Lianxun |
| 作者单位 | 1.Chinese Acad Sci, Changchun Inst Appl Chem, State Key Lab Polymer Phys & Chem, Changchun 130022, Peoples R China 2.Chinese Acad Sci, Grad Sch, Beijing, Peoples R China |
| 推荐引用方式 GB/T 7714 | Zhang, Minjie,Zhao, Hanying,Gao, Lianxun. Glass wafers bonding via Diels-Alder reaction at mild temperature[J]. SENSORS AND ACTUATORS A-PHYSICAL,2008,141(1):213-216. |
| APA | Zhang, Minjie,Zhao, Hanying,&Gao, Lianxun.(2008).Glass wafers bonding via Diels-Alder reaction at mild temperature.SENSORS AND ACTUATORS A-PHYSICAL,141(1),213-216. |
| MLA | Zhang, Minjie,et al."Glass wafers bonding via Diels-Alder reaction at mild temperature".SENSORS AND ACTUATORS A-PHYSICAL 141.1(2008):213-216. |
入库方式： OAI收割
来源：化学研究所
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