Preparation and Properties of Glass Cloth-Reinforced Polyimide Composites with Improved Impact Toughness for Microelectronics Packaging Substrates
文献类型：期刊论文
| 作者 | Xu, Hong-Yan; Yang, Hai-Xia; Tao, Li-Ming; Fan, Lin; Yang, Shi-Yong |
| 刊名 | JOURNAL OF APPLIED POLYMER SCIENCE
 |
| 出版日期 | 2010-07-15 |
| 卷号 | 117期号:2页码:1173-1183 |
| 关键词 | Thermosetting Polyimide Glass Cloth-reinforced Composite Mechanical Properties Isothermal Stability Packaging Substrates |
| ISSN号 | 0021-8995 |
| DOI | 10.1002/app.31914 |
| 英文摘要 | A series of glass cloth-reinforced thermosetting polyimide composites (EG/HTPI) were prepared from E-glass cloth (EG) and polyimide matrix resins. The polyimide resins were derived from 1,4-bis(4-amino-2-trifluoromethyl-phenoxy)benzene, p-phenylenediamine, diethyl ester of 3,3',4,4'-benzophenonetetracarboxylic acid, and monoethyl ester of cis-5-norbornene-endo-2,3-dicarboxylic acid. Based on the rheological properties of the B-staged polyimide resins, the optimized molding cycles were designed to fabricate the EG/HTPI laminates and the copper-clad laminates (Cu/EG/HTPI). Experimental results indicated that the EG/HTPI composites exhibited high thermal stability and outstanding mechanical properties. They had flexural strength of >534 MPa, flexural modulus of >20.0 GPa, and impact toughness of >46.9 kJ/m(2). The EG/HTPI composites also showed good electrical and dielectric properties. Moreover, the EG/HTPI laminates exhibited peel strength of similar to 1.2 N/mm and great isothermal stability at 288 degrees C for 60 min, showing good potential for application in high density packaging substrates. (C) 2010 Wiley Periodicals, Inc. J Appl Polym Sci 117: 1173-1183, 2010 |
| 语种 | 英语 |
| WOS记录号 | WOS:000278162600063 |
| 出版者 | JOHN WILEY & SONS INC |
| 源URL | [http://ir.iccas.ac.cn/handle/121111/70067]  |
| 专题 | 中国科学院化学研究所 |
| 通讯作者 | Xu, Hong-Yan |
| 作者单位 | Chinese Acad Sci, Inst Chem, Lab Adv Polymer Mat, Beijing 100190, Peoples R China |
| 推荐引用方式 GB/T 7714 | Xu, Hong-Yan,Yang, Hai-Xia,Tao, Li-Ming,et al. Preparation and Properties of Glass Cloth-Reinforced Polyimide Composites with Improved Impact Toughness for Microelectronics Packaging Substrates[J]. JOURNAL OF APPLIED POLYMER SCIENCE,2010,117(2):1173-1183. |
| APA | Xu, Hong-Yan,Yang, Hai-Xia,Tao, Li-Ming,Fan, Lin,&Yang, Shi-Yong.(2010).Preparation and Properties of Glass Cloth-Reinforced Polyimide Composites with Improved Impact Toughness for Microelectronics Packaging Substrates.JOURNAL OF APPLIED POLYMER SCIENCE,117(2),1173-1183. |
| MLA | Xu, Hong-Yan,et al."Preparation and Properties of Glass Cloth-Reinforced Polyimide Composites with Improved Impact Toughness for Microelectronics Packaging Substrates".JOURNAL OF APPLIED POLYMER SCIENCE 117.2(2010):1173-1183. |
入库方式： OAI收割
来源：化学研究所
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