Preparation and characterization of bismaleimide-diamine prepolymers and their thermal-curing behavior
文献类型：期刊论文
| 作者 | Wei, W; Dong, W; Cheng, Y |
| 刊名 | JOURNAL OF APPLIED POLYMER SCIENCE
 |
| 出版日期 | 1998-12-19 |
| 卷号 | 70期号:12页码:2471-2477 |
| 关键词 | Bismaleimide Diamine Prepolymer Fourier Transform Infrared Spectra Differential Scanning Colorimetry Thermal Gravimetric Analysis |
| ISSN号 | 0021-8995 |
| 英文摘要 | Various bismaleimide-diamine Michael addition type prepolymers were prepared through melt condensation and using acetone, dimethylformamide, and m-cresol as solvents in a molar ratio of 1 : 1. Structures of the prepolymers, such as terminal moieties and molecular weight of main chain, depended strongly an the preparation conditions used. More terminal double bonds were observed in the molecule of the prepolymer (sample 3) prepared in dimethylformamide solution without a catalyst. In contrast, the prepolymer produced in m-cresol solution had a polyaspartimide structure with a higher molecular weight. The differential scanning calorimetry and Fourier transform infrared spectra results demonstrated that the molecular structure of the prepolymer had a noticeable effect on their thermal-curing behavior. Thermal properties (T-g and T-d) of cured polymers were evaluated. The polyimide (sample 3b) from sample 3 exhibited the highest T-g and T-d1, but still retained very good processing properties for film casting. (C) 1998 John Wiley & Sons, Inc. |
| 语种 | 英语 |
| WOS记录号 | WOS:000076762700020 |
| 出版者 | JOHN WILEY & SONS INC |
| 源URL | [http://ir.iccas.ac.cn/handle/121111/74247]  |
| 专题 | 中国科学院化学研究所 |
| 通讯作者 | Dong, W |
| 作者单位 | Chinese Acad Sci, Inst Chem, Beijing 100080, Peoples R China |
| 推荐引用方式 GB/T 7714 | Wei, W,Dong, W,Cheng, Y. Preparation and characterization of bismaleimide-diamine prepolymers and their thermal-curing behavior[J]. JOURNAL OF APPLIED POLYMER SCIENCE,1998,70(12):2471-2477. |
| APA | Wei, W,Dong, W,&Cheng, Y.(1998).Preparation and characterization of bismaleimide-diamine prepolymers and their thermal-curing behavior.JOURNAL OF APPLIED POLYMER SCIENCE,70(12),2471-2477. |
| MLA | Wei, W,et al."Preparation and characterization of bismaleimide-diamine prepolymers and their thermal-curing behavior".JOURNAL OF APPLIED POLYMER SCIENCE 70.12(1998):2471-2477. |
入库方式： OAI收割
来源：化学研究所
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