Novel microencapsulated curing accelerator for prolonging shelf life of epoxy resin composition
文献类型:期刊论文
作者 | Cao, M; Xie, P; Jin, Z; Zhang, Y; Zhang, RB; Chung, TS; He, CB |
刊名 | JOURNAL OF APPLIED POLYMER SCIENCE
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出版日期 | 2002-07-25 |
卷号 | 85期号:4页码:873-878 |
关键词 | Microencapsulated Epoxy-curing Accelerator Imidazole Shelf Life Ladderlike Copolysiloxane Curing Of Polymers Polysiloxanes |
ISSN号 | 0021-8995 |
DOI | 10.1002/app.10699 |
英文摘要 | A novel micron-sized microencapsulated curing accelerator, imidazole (Im), particles, was first prepared by an ultrasound-assisted dispersing and spray-drying method and can significantly prolong the shelf life of epoxy resin-based microelectronic packaging material. The shell of the encapsulated particles was made from ladderlike copoly(phenyloctyl silsesquioxane) (Ph-Oct-T), which was synthesized by a ''stepwise coupling polymerization'' method. Its softening or flowing temperature can be adjusted by changing the composition. Carbon tetrachloride (CCl4) was chosen as both a solvent of the capsular material Ph-Oct-T and a suspending/precipitating agent of the fine Im particles. Subsequently, the solution containing Ph-Oct-T and suspended Im particles was treated by a spray-drying process to produce the micro encapsulated curing accelerator, Im particles, whose size and appearance was observed by scanning electronic microscopy (SEM). A greatly improved shelf life of the epoxy resin composition containing this microencapsulated curing accelerator was exhibited by curing tests and DSC measurements. (C) 2002 Wiley Periodicals, Inc. |
语种 | 英语 |
WOS记录号 | WOS:000175795800020 |
出版者 | JOHN WILEY & SONS INC |
源URL | [http://ir.iccas.ac.cn/handle/121111/78745] ![]() |
专题 | 中国科学院化学研究所 |
通讯作者 | Zhang, RB |
作者单位 | 1.Chinese Acad Sci, PCLCC, Ctr Mol Sci, Inst Chem, Beijing 100080, Peoples R China 2.Natl Univ Singapore, Inst Mat Res & Engn, Singapore 119260, Singapore |
推荐引用方式 GB/T 7714 | Cao, M,Xie, P,Jin, Z,et al. Novel microencapsulated curing accelerator for prolonging shelf life of epoxy resin composition[J]. JOURNAL OF APPLIED POLYMER SCIENCE,2002,85(4):873-878. |
APA | Cao, M.,Xie, P.,Jin, Z.,Zhang, Y.,Zhang, RB.,...&He, CB.(2002).Novel microencapsulated curing accelerator for prolonging shelf life of epoxy resin composition.JOURNAL OF APPLIED POLYMER SCIENCE,85(4),873-878. |
MLA | Cao, M,et al."Novel microencapsulated curing accelerator for prolonging shelf life of epoxy resin composition".JOURNAL OF APPLIED POLYMER SCIENCE 85.4(2002):873-878. |
入库方式: OAI收割
来源:化学研究所
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