中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Cooling Performance of an Impingement Cooling Device Combined with Pins

文献类型:期刊论文

作者Dongliang QUAN; Songling LIU; Jianghai LI; Gaowen LIU
刊名JOURNAL OF THERMAL SCIENCE
出版日期2005
卷号14期号:1页码:56,61
关键词Impingement Cooling Flow Resistance Cooling Effectiveness One-dimensional Model
英文摘要Experimental study and one dimensional model analysis were conducted to investigate cooling performance of an integrated impingement and pin fin cooling device. A typical configuration specimen was made and tested in a large scale low speed closed-looped wind tunnel. Detailed two-dimensional contour maps of the temperature and cooling effectiveness were obtained for different pressure ratios and therefore different coolant flow-rates through the tested specimen. The experimental results showed that very high cooling effectiveness can be achieved by this cooling device with relatively small amount of coolant flow. Based on the theory of transpiration cooling in porous material, a one dimensional heat transfer model was established to analyze the effect of various parameters on cooling effectiveness. It was found from this model that the variation of heat transfer on the gas side, including heat transfer coefficient and film cooling effectiveness, of the specimen created much more effect on its cooling effectiveness than that of the coolant side. The predictions of the one-dimensional mode were compared and agreed well with the experimental data.
公开日期2013-03-11
源URL[http://ir.etp.ac.cn/handle/311046/53168]  
专题工程热物理研究所_Journal of Thermal Science
推荐引用方式
GB/T 7714
Dongliang QUAN,Songling LIU,Jianghai LI,et al. Cooling Performance of an Impingement Cooling Device Combined with Pins[J]. JOURNAL OF THERMAL SCIENCE,2005,14(1):56,61.
APA Dongliang QUAN,Songling LIU,Jianghai LI,&Gaowen LIU.(2005).Cooling Performance of an Impingement Cooling Device Combined with Pins.JOURNAL OF THERMAL SCIENCE,14(1),56,61.
MLA Dongliang QUAN,et al."Cooling Performance of an Impingement Cooling Device Combined with Pins".JOURNAL OF THERMAL SCIENCE 14.1(2005):56,61.

入库方式: OAI收割

来源:工程热物理研究所

浏览0
下载0
收藏0
其他版本

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。