Electrical Capacitance Tomography Measurement of Flow Patterns and Film Thickness in a Thermosyphon
文献类型：期刊论文
| 作者 | Jingtao LI1; Qi CHEN2; Xiangyuan DONG1; Shi LIU1 |
| 刊名 | JOURNAL OF THERMAL SCIENCE
 |
| 出版日期 | 2005 |
| 卷号 | 14期号:1页码:81,86 |
| 关键词 | Thermosyphon Electrical Capacitance Tomography Film Thickness Flow Pattern |
| 英文摘要 | An experimental study was performed to evaluate the suitability of using an electrical capacitance tomography (ECT) system to visualize the flow patterns, and to measure the film thickness of the annular flow in a two-phase closed thermosyphon (TPCT). The performance of the ECT system was examined over a range of flow conditions. The experimental data were compared with the visual observations and existing correlations. Results indicated that the ECT system, with the linear back projection (LBP) algorithm, could be used to give an on-line qualitative image of the flow patterns. The Landweber iteration algorithm with optimal step length was implemented off-line to reconstruct high-resolution images. Then, the images were analyzed to obtain the film thickness of the annular flow. The experimental data compared well with the Nusselt’s equation in low vapor velocity range, but showed an increasing deficiency with the increase of vapor velocity. |
| 公开日期 | 2013-03-11 |
| 源URL | [http://ir.etp.ac.cn/handle/311046/53176]  |
| 专题 | 工程热物理研究所_Journal of Thermal Science |
| 推荐引用方式 GB/T 7714 | Jingtao LI1,Qi CHEN2,Xiangyuan DONG1,et al. Electrical Capacitance Tomography Measurement of Flow Patterns and Film Thickness in a Thermosyphon[J]. JOURNAL OF THERMAL SCIENCE,2005,14(1):81,86. |
| APA | Jingtao LI1,Qi CHEN2,Xiangyuan DONG1,&Shi LIU1.(2005).Electrical Capacitance Tomography Measurement of Flow Patterns and Film Thickness in a Thermosyphon.JOURNAL OF THERMAL SCIENCE,14(1),81,86. |
| MLA | Jingtao LI1,et al."Electrical Capacitance Tomography Measurement of Flow Patterns and Film Thickness in a Thermosyphon".JOURNAL OF THERMAL SCIENCE 14.1(2005):81,86. |
入库方式： OAI收割
来源：工程热物理研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。