Effects of Surface Roughness of Capillary Wall on the Profile of Thin LiquidFilm and Evaporation Heat Transfer
文献类型：期刊论文
| 作者 | Qu Wei; Ma Tongze |
| 刊名 | JOURNAL OF THERMAL SCIENCE
 |
| 出版日期 | 2001 |
| 卷号 | 10期号:3页码:240246 |
| 关键词 | Periodic Microrelief Roughness Angle Roughness Height. |
| 英文摘要 | The surface of capillary wall can be treated to have a periodic microrelief mathematically. The roughness is micro enough compared with the thickness of the liquid film. So, the surface roughness only exerts influence on the adsorptive potential. Macroscopically, the flow field of the liquid film can be considered as that when the rough surface has an equivalent smooth surface, whose position is at the crests of the microrelief. The mechanism of heat transfer is in connection with two resistances: the thermal resistance of the liquid film conduction and the thermal resistance of the interfacial evaporation. The capillary pressure between the two sides of the vapor-liquid interface due to the interfacial curvature and the disjoining pressure owing to the thin liquid film are considered simultaneously. Several micro tubes with different micro rough surfaces are studied. The length of the evaporating interfacial region decreases with the increase of roughness angle and/or the increase of the roughness height. The heat transfer coefficient and the temperature of the vapor-liquid interface will change to fit the constant mass flow rate. |
| 公开日期 | 2013-03-12 |
| 源URL | [http://ir.etp.ac.cn/handle/311046/53716]  |
| 专题 | 工程热物理研究所_Journal of Thermal Science |
| 推荐引用方式 GB/T 7714 | Qu Wei,Ma Tongze. Effects of Surface Roughness of Capillary Wall on the Profile of Thin LiquidFilm and Evaporation Heat Transfer[J]. JOURNAL OF THERMAL SCIENCE,2001,10(3):240246. |
| APA | Qu Wei,&Ma Tongze.(2001).Effects of Surface Roughness of Capillary Wall on the Profile of Thin LiquidFilm and Evaporation Heat Transfer.JOURNAL OF THERMAL SCIENCE,10(3),240246. |
| MLA | Qu Wei,et al."Effects of Surface Roughness of Capillary Wall on the Profile of Thin LiquidFilm and Evaporation Heat Transfer".JOURNAL OF THERMAL SCIENCE 10.3(2001):240246. |
入库方式： OAI收割
来源：工程热物理研究所
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