Measurement of Thermal Expansion Coefficients with Holographic Technique
文献类型:期刊论文
作者 | Zhifeng Zhang |
刊名 | JOURNAL OF THERMAL SCIENCE
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出版日期 | 1995 |
卷号 | 4期号:1页码:67,74 |
关键词 | Thermal Expansion Holographic Measurement Low Temperature Tests Deformation tests. |
英文摘要 | A simplified mathematical model was created for measurement of thermal expansion coefficients of thin sheet materials with holographic technique. Experimental set-ups corresponding to the mathematical model were designed and built for both tests above room temperature and at low temperatures. A fringe control technique was introduced for low temperature measurements to compensate rigid body movement. Thin sheet specimens of silicon and aluminum alloy (7075) were tested with the developed technique. The tested results are in good agreement with reported data and thus verify the validity of the developed technique. The thermal expansion coefficients of the tested materials ranged from 2.5 × 10−6°C−1 to 23.6 × 10−6°C−1. |
公开日期 | 2013-03-13 |
源URL | [http://ir.etp.ac.cn/handle/311046/54216] ![]() |
专题 | 工程热物理研究所_Journal of Thermal Science |
推荐引用方式 GB/T 7714 | Zhifeng Zhang. Measurement of Thermal Expansion Coefficients with Holographic Technique[J]. JOURNAL OF THERMAL SCIENCE,1995,4(1):67,74. |
APA | Zhifeng Zhang.(1995).Measurement of Thermal Expansion Coefficients with Holographic Technique.JOURNAL OF THERMAL SCIENCE,4(1),67,74. |
MLA | Zhifeng Zhang."Measurement of Thermal Expansion Coefficients with Holographic Technique".JOURNAL OF THERMAL SCIENCE 4.1(1995):67,74. |
入库方式: OAI收割
来源:工程热物理研究所
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