中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Measurement of Thermal Expansion Coefficients with Holographic Technique

文献类型:期刊论文

作者Zhifeng Zhang
刊名JOURNAL OF THERMAL SCIENCE
出版日期1995
卷号4期号:1页码:67,74
关键词Thermal Expansion Holographic Measurement Low Temperature Tests Deformation tests.
英文摘要A simplified mathematical model was created for measurement of thermal expansion coefficients of thin sheet materials with holographic technique. Experimental set-ups corresponding to the mathematical model were designed and built for both tests above room temperature and at low temperatures. A fringe control technique was introduced for low temperature measurements to compensate rigid body movement. Thin sheet specimens of silicon and aluminum alloy (7075) were tested with the developed technique. The tested results are in good agreement with reported data and thus verify the validity of the developed technique. The thermal expansion coefficients of the tested materials ranged from 2.5 × 10−6°C−1 to 23.6 × 10−6°C−1.
公开日期2013-03-13
源URL[http://ir.etp.ac.cn/handle/311046/54216]  
专题工程热物理研究所_Journal of Thermal Science
推荐引用方式
GB/T 7714
Zhifeng Zhang. Measurement of Thermal Expansion Coefficients with Holographic Technique[J]. JOURNAL OF THERMAL SCIENCE,1995,4(1):67,74.
APA Zhifeng Zhang.(1995).Measurement of Thermal Expansion Coefficients with Holographic Technique.JOURNAL OF THERMAL SCIENCE,4(1),67,74.
MLA Zhifeng Zhang."Measurement of Thermal Expansion Coefficients with Holographic Technique".JOURNAL OF THERMAL SCIENCE 4.1(1995):67,74.

入库方式: OAI收割

来源:工程热物理研究所

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