Force Convective Air Cooling from Electronic Component Arrays in a Parallel Plate Channel
文献类型：期刊论文
| 作者 | D.Y. Cai1; Y.P. Gan; C.F. Ma; Q.X. Li2 |
| 刊名 | JOURNAL OF THERMAL SCIENCE
 |
| 出版日期 | 1994 |
| 卷号 | 3期号:3页码:161,166 |
| 关键词 | Convection Heat Transfer Air Cooling |
| 英文摘要 | This paper discusses air forced convection heat transfer from inline protruding elements arranged in eight rows. The streamwise and spanwise spacings between elements were varied using a splitter plate that can be positioned at three different modular configurations. A set of empirical formulas was presented to correlate the experimental data for the design of air cooling systems. Arrays of components with one odd- size module have been tested also. Experimental results show that blocks near the entrance and behind the odd- size module have improved performance compared with uniform arrangements. Accordingly, temperature sensitive components are suggested to be arranged in these locations. |
| 公开日期 | 2013-03-13 |
| 源URL | [http://ir.etp.ac.cn/handle/311046/54324]  |
| 专题 | 工程热物理研究所_Journal of Thermal Science |
| 推荐引用方式 GB/T 7714 | D.Y. Cai1,Y.P. Gan,C.F. Ma,et al. Force Convective Air Cooling from Electronic Component Arrays in a Parallel Plate Channel[J]. JOURNAL OF THERMAL SCIENCE,1994,3(3):161,166. |
| APA | D.Y. Cai1,Y.P. Gan,C.F. Ma,&Q.X. Li2.(1994).Force Convective Air Cooling from Electronic Component Arrays in a Parallel Plate Channel.JOURNAL OF THERMAL SCIENCE,3(3),161,166. |
| MLA | D.Y. Cai1,et al."Force Convective Air Cooling from Electronic Component Arrays in a Parallel Plate Channel".JOURNAL OF THERMAL SCIENCE 3.3(1994):161,166. |
入库方式： OAI收割
来源：工程热物理研究所
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