中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Electrodeposition of anisotropic NiFe thin films for integrated high-frequency micro-inductor

文献类型:期刊论文

作者Yang, LL; Gao, LY; Chen, CH; Liu, ZQ
刊名2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
出版日期2018-01-04
页码1241-1245
关键词micro-inductor NiFe thin film in-plane anisotropy magnetic electroplating
英文摘要NiFe thin films were fabricated on wafer by applying 100mT external magnetic field during electroplating, and the function of in-plane parallel magnetic field in the course of the plating experiment and magnetic properties have been studied in this paper. Magnetic measurements show that in-plane anisotropy field can be abtained by magnet-electroplating, and the magnetic properties are very sensitive to the thickness of film. The Ni70Fe30 film with thickness of both 0.6 mu m and 1.2 mu m exhibit significantly uniaxial surface anisotropy and the complex permeability of the direction of parallel magnetic field can reach about 220 while 2 mu m NiFe thin film does not have a uniaxial magnetic anisotropy. The results also show that the ferromagnetic-resonance frequency(FMR) can run up to 500Mz when the thickness is suitable, which is an essential performance in the design of micro-inductor devices.
学科主题Engineering, Electrical & Electronic
语种英语
WOS记录号WOS:000450155700273
源URL[http://ir.imr.ac.cn/handle/321006/80222]  
专题金属研究所_中国科学院金属研究所
作者单位1.[Yang, Lin-Lin
2.Dalian Jiaotong Univ, Sch Mat Sci & Engn, Dalian 116024, Peoples R China
3.[Yang, Lin-Lin
4.Gao, Li-Yin
5.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China
推荐引用方式
GB/T 7714
Yang, LL,Gao, LY,Chen, CH,et al. Electrodeposition of anisotropic NiFe thin films for integrated high-frequency micro-inductor[J]. 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT),2018:1241-1245.
APA Yang, LL,Gao, LY,Chen, CH,&Liu, ZQ.(2018).Electrodeposition of anisotropic NiFe thin films for integrated high-frequency micro-inductor.2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT),1241-1245.
MLA Yang, LL,et al."Electrodeposition of anisotropic NiFe thin films for integrated high-frequency micro-inductor".2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) (2018):1241-1245.

入库方式: OAI收割

来源:金属研究所

浏览0
下载0
收藏0
其他版本

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。