Materials, processing and reliability of low temperature bonding in 3D chip stacking
文献类型：期刊论文
| 作者 | Zhang, L; Liu, ZQ; Chen, SW; Wang, YD; Long, WM; Guo, YH; Wang, SQ; Ye, G; Liu, WY |
| 刊名 | JOURNAL OF ALLOYS AND COMPOUNDS
 |
| 出版日期 | 2018-06-25 |
| 卷号 | 750页码:980-995 |
| ISSN号 | 0925-8388 |
| 关键词 | 3D IC Low temperature bonding Bonding method Reliability |
| DOI | 10.1016/j.jallcom.2018.04.040 |
| 英文摘要 | Due to the advantages of small form factor, high performance, low power consumption, and high density integration, three-dimensional integrated circuits (3D ICs) have been generally acknowledged as the next generation semiconductor technology. Low temperature bonding is the key technology to ensure the chip (or wafer) stacking in 3D ICs. In this paper, different low temperature bonding methods for chip (or wafer) stacking were reviewed and described systematically. Materials, processing and reliability will be extremely important, their effects on the 3D IC structure were addressed in detail, the challenging reliability issues may be considered as the major concern in the future work. The latest development of low temperature bonding in 3D ICs is also given here, which helpful may provide a reference for the further study of low temperature bonding. (C) 2018 Elsevier B.V. All rights reserved. |
| 学科主题 | Chemistry, Physical ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000432668500118 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/80149]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 作者单位 | 1.[Zhang, Liang 2.Guo, Yong-huan 3.Wang, Song-quan 4.Ye, Guo 5.Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Peoples R China 6.[Zhang, Liang 7.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China 8.Natl Tsing Hua Univ, Dept Chem Engn, Hsinchu, Taiwan 9.Intel Corp, 5000W Chandler Blvd, Phoenix, AZ 85226 USA 10.Zhengzhou Res Inst Mech Engn, State Key Lab Adv Brazing Filler Met & Technol, Zhengzhou 450001, Henan, Peoples R China |
| 推荐引用方式 GB/T 7714 | Zhang, L,Liu, ZQ,Chen, SW,et al. Materials, processing and reliability of low temperature bonding in 3D chip stacking[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2018,750:980-995. |
| APA | Zhang, L.,Liu, ZQ.,Chen, SW.,Wang, YD.,Long, WM.,...&Liu, WY.(2018).Materials, processing and reliability of low temperature bonding in 3D chip stacking.JOURNAL OF ALLOYS AND COMPOUNDS,750,980-995. |
| MLA | Zhang, L,et al."Materials, processing and reliability of low temperature bonding in 3D chip stacking".JOURNAL OF ALLOYS AND COMPOUNDS 750(2018):980-995. |
入库方式： OAI收割
来源：金属研究所
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