中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing

文献类型:期刊论文

作者Wang, J; Chen, G; Sun, FL; Zhou, ZX; Liu, ZQ; Liu, CQ
刊名CORROSION SCIENCE
出版日期2018-07-15
卷号139页码:383-394
关键词Electronic materials Intermetallics Metal coatings Tin STEM Oxidation
ISSN号0010-938X
DOI10.1016/j.corsci.2018.05.020
英文摘要We report new insights into the solder wettability degradation of Sn thin films on Cu under 155 degrees C isothermal ageing. A multiscale wettability degradation model was established, reflecting quantitatively the surface oxidation and interfacial intermetallic compound (IMC) growth, on the basis of solder wetting behaviour. The thermal oxidation of Sn exhibited heterogeneous inward thickening, lateral expanding and outward platelet-like growth, forming nanocrystalline, oxygen-deficient SnO2 with pronounced voiding/cracking propensity. Unlike a commonly held belief that the initial wettability loss is due to surface-exposing and oxidation of IMCs, it was found from dual combined effects of inward surface oxidation and outward IMC growth.
学科主题Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
语种英语
WOS记录号WOS:000438478200035
源URL[http://ir.imr.ac.cn/handle/321006/80099]  
专题金属研究所_中国科学院金属研究所
作者单位1.Loughborough Univ Technol, Wolfson Sch Mech Elect & Mfg Engn, Loughborough LE11 3TU, Leics, England
2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China
3.Univ Chinese Acad Sci, Beijing 100049, Peoples R China
4.Loughborough Univ Technol, Dept Mat, Loughborough Mat Characterisat Ctr, Loughborough LE11 3TU, Leics, England
推荐引用方式
GB/T 7714
Wang, J,Chen, G,Sun, FL,et al. Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing[J]. CORROSION SCIENCE,2018,139:383-394.
APA Wang, J,Chen, G,Sun, FL,Zhou, ZX,Liu, ZQ,&Liu, CQ.(2018).Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing.CORROSION SCIENCE,139,383-394.
MLA Wang, J,et al."Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing".CORROSION SCIENCE 139(2018):383-394.

入库方式: OAI收割

来源:金属研究所

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