Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing
文献类型：期刊论文
| 作者 | Wang, J; Chen, G; Sun, FL; Zhou, ZX; Liu, ZQ; Liu, CQ |
| 刊名 | CORROSION SCIENCE
 |
| 出版日期 | 2018-07-15 |
| 卷号 | 139页码:383-394 |
| 关键词 | Electronic materials Intermetallics Metal coatings Tin STEM Oxidation |
| ISSN号 | 0010-938X |
| DOI | 10.1016/j.corsci.2018.05.020 |
| 英文摘要 | We report new insights into the solder wettability degradation of Sn thin films on Cu under 155 degrees C isothermal ageing. A multiscale wettability degradation model was established, reflecting quantitatively the surface oxidation and interfacial intermetallic compound (IMC) growth, on the basis of solder wetting behaviour. The thermal oxidation of Sn exhibited heterogeneous inward thickening, lateral expanding and outward platelet-like growth, forming nanocrystalline, oxygen-deficient SnO2 with pronounced voiding/cracking propensity. Unlike a commonly held belief that the initial wettability loss is due to surface-exposing and oxidation of IMCs, it was found from dual combined effects of inward surface oxidation and outward IMC growth. |
| 学科主题 | Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| WOS记录号 | WOS:000438478200035 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/80099]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 作者单位 | 1.Loughborough Univ Technol, Wolfson Sch Mech Elect & Mfg Engn, Loughborough LE11 3TU, Leics, England 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China 3.Univ Chinese Acad Sci, Beijing 100049, Peoples R China 4.Loughborough Univ Technol, Dept Mat, Loughborough Mat Characterisat Ctr, Loughborough LE11 3TU, Leics, England |
| 推荐引用方式 GB/T 7714 | Wang, J,Chen, G,Sun, FL,et al. Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing[J]. CORROSION SCIENCE,2018,139:383-394. |
| APA | Wang, J,Chen, G,Sun, FL,Zhou, ZX,Liu, ZQ,&Liu, CQ.(2018).Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing.CORROSION SCIENCE,139,383-394. |
| MLA | Wang, J,et al."Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing".CORROSION SCIENCE 139(2018):383-394. |
入库方式： OAI收割
来源：金属研究所
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