Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current
文献类型：期刊论文
| 作者 | Zhu, QS; Gao, F; Ma, HC; Liu, ZQ; Guo, JD; Zhang, L; Zhu, QS (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China. |
| 刊名 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
 |
| 出版日期 | 2018-03-01 |
| 卷号 | 29期号:6页码:5025-5033 |
| 关键词 | Stress-relaxation Void Formation Electromigration Reliability Sn Interconnections Thermomigration Metallization Mechanisms Diffusion |
| ISSN号 | 0957-4522 |
| 英文摘要 | In this work, the failure behavior of a commercial chip size packaging (CSP) with flip chip solder joint was investigated under the coupling condition of thermal cycling and electrical current. The damage behavior of solder joint was real-time monitored through the electrical resistance response. The microstructure evolution under the coupling condition were observed. The failure was classified as three modes, i.e., the cracking within solder on the PCB side (mode I), the cracking along the solder/IMC interface (mode II) and the detachment between the solder and chip due to the complete dissolving of Cu UBM layer (mode III). At low current density the mode I accounted for a large percentage while the mode II and mode III accounted for a large percentage at high current density. Based on the Weibull distribution of failure life, it was found that the mean time to failure sharply decreased with the increasing current density. A lifetime prediction model was constructed for the reliability test under coupling condition of thermal cycling and electrical current.; In this work, the failure behavior of a commercial chip size packaging (CSP) with flip chip solder joint was investigated under the coupling condition of thermal cycling and electrical current. The damage behavior of solder joint was real-time monitored through the electrical resistance response. The microstructure evolution under the coupling condition were observed. The failure was classified as three modes, i.e., the cracking within solder on the PCB side (mode I), the cracking along the solder/IMC interface (mode II) and the detachment between the solder and chip due to the complete dissolving of Cu UBM layer (mode III). At low current density the mode I accounted for a large percentage while the mode II and mode III accounted for a large percentage at high current density. Based on the Weibull distribution of failure life, it was found that the mean time to failure sharply decreased with the increasing current density. A lifetime prediction model was constructed for the reliability test under coupling condition of thermal cycling and electrical current. |
| 学科主题 | Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter |
| 语种 | 英语 |
| 资助机构 | National Natural Science Foundation of China (NSFC) [51471180, 51101161]; Science and Technology Program of Shenyang [F16-205-1-18] |
| 公开日期 | 2018-06-05 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/79464]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Zhu, QS (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Zhu, QS,Gao, F,Ma, HC,et al. Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(6):5025-5033. |
| APA | Zhu, QS.,Gao, F.,Ma, HC.,Liu, ZQ.,Guo, JD.,...&Zhu, QS .(2018).Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,29(6),5025-5033. |
| MLA | Zhu, QS,et al."Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 29.6(2018):5025-5033. |
入库方式： OAI收割
来源：金属研究所
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