The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage
文献类型：期刊论文
| 作者 | Gao, LY; Li, CF; Wan, P; Zhang, H; Liu, ZQ; Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.; Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan. |
| 刊名 | JOURNAL OF ALLOYS AND COMPOUNDS
 |
| 出版日期 | 2018-03-30 |
| 卷号 | 739页码:632-642 |
| 关键词 | Lead-free Solders Interfacial Reactions Sn-ag Intermetallic Compounds Rich Solders Joints Growth Reliability Substrate Strength |
| ISSN号 | 0925-8388 |
| 英文摘要 | High temperature storage was conducted on SnAgCu/Fe-Ni (73 wt% Ni and 45 wt% Ni) as well as SnAgCu/Cu solder joints at 125 degrees C, 150 degrees C, and 175 degrees C to evaluate the diffusion barrier effect of Fe-Ni under bump metallization (UBM). For Fe-73Ni solder joints, rod-like (Cu, Ni)(6)Sn-5 finally accumulated in the form of a continuous outer layer on the FeSn2 layer, as the aging time increased. Compared to Cu UBM, the Fe-73Ni UBM showed a better diffusion barrier effect at 125 degrees C and 150 degrees C. However, when the temperature increased to 175 degrees C, the inter-diffusion between FeSn2 and (Cu, Ni)(6)Sn-5 generated a mixed IMC layer, which further transformed into the (Ni, Cu)(3)Sn-4 phase which was accompanied with an abrupt increase of IMC thickness and rapid dissolution of UBM. In terms of the SAC/Fe-45Ni solder joints, the growth rate of (Cu, Ni)(6)Sn-5 and the transformation of (Ni, Cu)(3)Sn-4 were both suppressed, resulting in a compact FeSn2 layer and a higher Fe content after the UBM. As a result, the Fe-45Ni UBM showed an excellent diffusion barrier effect from 125 degrees C to 175 degrees C, as compared to the Cu and Fe-73Ni UBM. Using the statistical thicknesses of the interfacial intermetallic compounds (IMCs), the activation energies of the diffusion controlled growth of FeSn2 and (Cu, Ni)(6)Sn-5 in Fe-45Ni solder joints were calculated as 106 kJ/mol and 122 kJ/mol, which were higher than that for the Cu3Sn (97 kJ/mol) and Cu6Sn5 (86 kJ/mol) in the Cu solder joints. (c) 2017 Elsevier B.V. All rights reserved.; High temperature storage was conducted on SnAgCu/Fe-Ni (73 wt% Ni and 45 wt% Ni) as well as SnAgCu/Cu solder joints at 125 degrees C, 150 degrees C, and 175 degrees C to evaluate the diffusion barrier effect of Fe-Ni under bump metallization (UBM). For Fe-73Ni solder joints, rod-like (Cu, Ni)(6)Sn-5 finally accumulated in the form of a continuous outer layer on the FeSn2 layer, as the aging time increased. Compared to Cu UBM, the Fe-73Ni UBM showed a better diffusion barrier effect at 125 degrees C and 150 degrees C. However, when the temperature increased to 175 degrees C, the inter-diffusion between FeSn2 and (Cu, Ni)(6)Sn-5 generated a mixed IMC layer, which further transformed into the (Ni, Cu)(3)Sn-4 phase which was accompanied with an abrupt increase of IMC thickness and rapid dissolution of UBM. In terms of the SAC/Fe-45Ni solder joints, the growth rate of (Cu, Ni)(6)Sn-5 and the transformation of (Ni, Cu)(3)Sn-4 were both suppressed, resulting in a compact FeSn2 layer and a higher Fe content after the UBM. As a result, the Fe-45Ni UBM showed an excellent diffusion barrier effect from 125 degrees C to 175 degrees C, as compared to the Cu and Fe-73Ni UBM. Using the statistical thicknesses of the interfacial intermetallic compounds (IMCs), the activation energies of the diffusion controlled growth of FeSn2 and (Cu, Ni)(6)Sn-5 in Fe-45Ni solder joints were calculated as 106 kJ/mol and 122 kJ/mol, which were higher than that for the Cu3Sn (97 kJ/mol) and Cu6Sn5 (86 kJ/mol) in the Cu solder joints. (c) 2017 Elsevier B.V. All rights reserved. |
| 学科主题 | Chemistry, Physical ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
| 语种 | 英语 |
| 资助机构 | National Key R&D Program of China [2017YFB0305501]; Natural Science Foundation of China [51401218]; Osaka University Visiting Scholar Program [J135104902] |
| 公开日期 | 2018-06-05 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/79418]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Li, CF; Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.; Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan. |
| 推荐引用方式 GB/T 7714 | Gao, LY,Li, CF,Wan, P,et al. The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2018,739:632-642. |
| APA | Gao, LY.,Li, CF.,Wan, P.,Zhang, H.,Liu, ZQ.,...&Liu, ZQ .(2018).The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage.JOURNAL OF ALLOYS AND COMPOUNDS,739,632-642. |
| MLA | Gao, LY,et al."The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage".JOURNAL OF ALLOYS AND COMPOUNDS 739(2018):632-642. |
入库方式： OAI收割
来源：金属研究所
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