Clean, fast and scalable transfer of ultrathin/patterned vertically-aligned carbon nanotube arrays
文献类型：期刊论文
| 作者 | Ping, LQ; Hou, PX; Wang, H; Chen, ML; Zhao, Y; Cong, HT; Liu, C; Cheng, HM; Liu, C (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China. |
| 刊名 | CARBON
 |
| 出版日期 | 2018-07-01 |
| 卷号 | 133页码:275-282 |
| 关键词 | Dry Adhesives High-quality Density Growth Temperature Performance Batteries Forests |
| ISSN号 | 0008-6223 |
| 英文摘要 | The difficulty of transferring vertically-aligned carbon nanotube (VACNT) arrays onto specific substrates limits their use in many fields, for instance as thermal interface materials or electrical interconnects in microelectronics. Current transfer techniques are either limited by the type and shape of the target substrate, or their inability to transfer patterned and thin VACNT arrays. Here, we report a simple and clean press transfer method that does not use transfer media, and involves only pressing and lifting steps. This method enables not only the transfer of patterned and very thin VACNT arrays but also the tight adhesion of the arrays onto various flat or curved target substrates. Flexible and transparent electrodes were fabricated by transferring inter-digitated VACNT patterns onto a PET substrate. VACNT arrays with a thickness of 20 mu m were transferred onto target substrates cleanly, showing a very low thermal resistance of similar to 26 K mm(2) W-1. The transferred clean, thin VACNT arrays show good heat dissipation as thermal interface material when integrated into a desktop computer CPU cooling system. (C) 2018 Elsevier Ltd. All rights reserved.; The difficulty of transferring vertically-aligned carbon nanotube (VACNT) arrays onto specific substrates limits their use in many fields, for instance as thermal interface materials or electrical interconnects in microelectronics. Current transfer techniques are either limited by the type and shape of the target substrate, or their inability to transfer patterned and thin VACNT arrays. Here, we report a simple and clean press transfer method that does not use transfer media, and involves only pressing and lifting steps. This method enables not only the transfer of patterned and very thin VACNT arrays but also the tight adhesion of the arrays onto various flat or curved target substrates. Flexible and transparent electrodes were fabricated by transferring inter-digitated VACNT patterns onto a PET substrate. VACNT arrays with a thickness of 20 mu m were transferred onto target substrates cleanly, showing a very low thermal resistance of similar to 26 K mm(2) W-1. The transferred clean, thin VACNT arrays show good heat dissipation as thermal interface material when integrated into a desktop computer CPU cooling system. (C) 2018 Elsevier Ltd. All rights reserved. |
| 学科主题 | Chemistry, Physical ; Materials Science, Multidisciplinary |
| 语种 | 英语 |
| 资助机构 | Ministry of Science and Technology of China [2016YFA0200101]; National Natural Science Foundation of China [51625203, 51532008, 51521091, 51572264, 51772303]; Chinese Academy of Sciences [174321KYSB20160011, KGZD-EW-T06]; CAS/SAFEA International Partnership Program for Creative Research Teams; MOPPI project of the Aalto University AEF Research Program; Liaoning BaiQianWan Talents Program |
| 公开日期 | 2018-06-05 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/79283]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 通讯作者 | Hou, PX; Liu, C (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Ping, LQ,Hou, PX,Wang, H,et al. Clean, fast and scalable transfer of ultrathin/patterned vertically-aligned carbon nanotube arrays[J]. CARBON,2018,133:275-282. |
| APA | Ping, LQ.,Hou, PX.,Wang, H.,Chen, ML.,Zhao, Y.,...&Liu, C .(2018).Clean, fast and scalable transfer of ultrathin/patterned vertically-aligned carbon nanotube arrays.CARBON,133,275-282. |
| MLA | Ping, LQ,et al."Clean, fast and scalable transfer of ultrathin/patterned vertically-aligned carbon nanotube arrays".CARBON 133(2018):275-282. |
入库方式： OAI收割
来源：金属研究所
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