Ar-buffer-assisted deposition of Cu-13 on Cu(111) surfaces
文献类型：期刊论文
| 作者 | Zang, LK; Wang, YX; Pan, ZY; Zhou, L; Liu, TJ; Zhu, J; Jiang, XM |
| 刊名 | SURFACE SCIENCE
 |
| 出版日期 | 2006-02-01 |
| 卷号 | 600页码:527-531 |
| 关键词 | small Cu cluster Ar-buffer nondestructive deposition molecular dynamics simulation |
| ISSN号 | 0039-6028 |
| DOI | 10.1016/j.susc.2005.11.002 |
| 英文摘要 | In this paper, the deposition of Cu-13 onto Cu(1 1 1) surface through argon buffer layers was investigated by molecular dynamics (MD) simulations. The interactions between Cu-Cu, Cu-Ar, and Ar-Ar were described by Finnis-Sinclair (FS) tight-binding potential and L-J potential, respectively. The impact energy was chosen to be 2-6 eV/atom in order to compare with experimental results. It was observed that with Ar-buffer layers, the Cu cluster deposited on the surface may retain its free cluster symmetry (11,). Whereas, on originally bare Cu surface, the deposited Cu cluster lost its original symmetry completely and was recrystalized to have the same fcc structure as the substrate. The Ar-buffer dissipates most of the translational energy of the incident cluster. Therefore, it prevents the cluster from being overheated upon impinging. Furthermore, the interaction between Ar and Cu benefits the confinement of the cluster structure. Our study shows that with Ar-buffer layers, the lateral spread of deposited clusters is 20% smaller than that on the bare Cu surface. This is consistent with the experimental findings. (c) 2005 Elsevier B.V. All rights reserved. |
| WOS关键词 | MOLECULAR-DYNAMICS SIMULATIONS ; CLUSTER DEPOSITION ; FRAGMENTATION ; GROWTH ; ENERGY ; ARGON |
| WOS研究方向 | Chemistry ; Physics |
| 语种 | 英语 |
| WOS记录号 | WOS:000235509300006 |
| 出版者 | ELSEVIER SCIENCE BV |
| 源URL | [http://119.78.100.186/handle/113462/26994]  |
| 专题 | 中国科学院近代物理研究所 |
| 通讯作者 | Pan, ZY |
| 作者单位 | 1.Fudan Univ, Inst Modern Phys, Shanghai 200433, Peoples R China 2.State Key Lab Adv Photon Mat & Devices, Shanghai 200433, Peoples R China |
| 推荐引用方式 GB/T 7714 | Zang, LK,Wang, YX,Pan, ZY,et al. Ar-buffer-assisted deposition of Cu-13 on Cu(111) surfaces[J]. SURFACE SCIENCE,2006,600:527-531. |
| APA | Zang, LK.,Wang, YX.,Pan, ZY.,Zhou, L.,Liu, TJ.,...&Jiang, XM.(2006).Ar-buffer-assisted deposition of Cu-13 on Cu(111) surfaces.SURFACE SCIENCE,600,527-531. |
| MLA | Zang, LK,et al."Ar-buffer-assisted deposition of Cu-13 on Cu(111) surfaces".SURFACE SCIENCE 600(2006):527-531. |
入库方式： OAI收割
来源：近代物理研究所
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