Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al
文献类型：期刊论文
| 作者 | Chen SD; Ke FJ(柯孚久) ; Zhou M; Bai YL(白以龙)
|
| 刊名 | Acta Materialia
 |
| 出版日期 | 2007 |
| 卷号 | 55期号:9页码:3169-3175 |
| 通讯作者邮箱 | chensd@lnm.imech.ac.cn |
| 关键词 | Diffusion Bonding Molecular Dynamics Temperature Effect Tensile Strength Molecular-Dynamics Simulation Embedded-Atom-Method Theoretical-Model Interface Alloys Copper Metals Ni |
| ISSN号 | 1359-6454 |
| 通讯作者 | Chen, SD (reprint author), Chinese Acad Sci, State Key Lab Non Linear Mech, Inst Mech, Beijing 100080, Peoples R China. |
| 中文摘要 | Molecular dynamics (MD) simulations are carried out to analyze the diffusion bonding at Cu/Al interfaces. The results indicate that the thickness of the interfacial layer is temperature-dependent, with higher temperatures yielding larger thicknesses. At temperatures below 750 K, the interface thickness is found to increase in a stepwise manner as a function of time. At temperatures above 750 K, the thickness increases rapidly and smoothly. When surface roughness is present, the bonding process consists of three stages. In the first stage, surfaces deform under stress, resulting in increased contact areas. The second stage involves significant plastic deformation at the interface as temperature increases, resulting in the disappearance of interstices and full contact of the surface pair. The last stage entails the diffusion of atoms under constant temperature. The bonded specimens show tensile strengths reaching 88% of the ideal Cu/Al contact strength. (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
| 类目[WOS] | Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
| 研究领域[WOS] | Materials Science ; Metallurgy & Metallurgical Engineering |
| 关键词[WOS] | MOLECULAR-DYNAMICS SIMULATION ; EMBEDDED-ATOM-METHOD ; THEORETICAL-MODEL ; INTERFACE ; ALLOYS ; COPPER ; METALS ; NI |
| 收录类别 | SCI ; EI |
| 语种 | 英语 |
| WOS记录号 | WOS:000246653000025 |
| 公开日期 | 2009-08-03 ; 2010-06-13 |
| 源URL | [http://dspace.imech.ac.cn/handle/311007/33987]  |
| 专题 | 力学研究所_力学所知识产出(1956-2008) |
| 推荐引用方式 GB/T 7714 | Chen SD,Ke FJ,Zhou M,et al. Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al[J]. Acta Materialia,2007,55(9):3169-3175. |
| APA | Chen SD,柯孚久,Zhou M,&白以龙.(2007).Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al.Acta Materialia,55(9),3169-3175. |
| MLA | Chen SD,et al."Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al".Acta Materialia 55.9(2007):3169-3175. |
入库方式： OAI收割
来源：力学研究所
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