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Low energy Cu clusters slow deposition on a Fe (001) surface investigated by molecular dynamics simulation

文献类型：期刊论文

作者Zhang, Shixu2,3; Gong, Hengfeng1,2; Chen, Xuanzhi2; Li, Gongping2; Wang, Zhiguang3
刊名APPLIED SURFACE SCIENCE
出版日期2014-09-30
卷号314页码:433-442
关键词Molecular Dynamics Simulation Low Energy Cluster Deposition Contact Epitaxy Thermal Diffusion Cu Cluster Fe Surface
ISSN号0169-4332
DOI10.1016/j.apsusc.2014.07.016
文献子类Article
英文摘要The slow deposition of low energy Cu clusters on a Fe (001) surface was investigated by molecular dynamics simulation. A many-body potential based on Finnis-Sinclair model was used to describe the interactions among atoms. Three clusters comprising of 13, 55 and 147 atoms, respectively, were deposited with incident energies ranging from 0.0 to 1.0 eV/atom at various substrate temperatures (0, 300 and 800 K). The rearrangement and the diffusion of cluster can occur, only when the cluster atoms are activated and obtained enough migration energy. The interaction between low energy cluster and substrate can be divided to the landing and the thermal diffusion phases. In the former, the migration energy originates from the latent heat of binding energy for the soft deposition regime and primarily comes from the incident energy of cluster for the energetic cluster deposition regime. In the latter, the thermal vibration would result in some cluster atoms activated again at medium and high substrate temperatures. Also, the effects of incident energy, cluster size and substrate temperature on the interaction potential energy between cluster and substrate, the final deposition morphology of cluster, the spreading index and the structure parameter of cluster are analyzed. (C) 2014 Elsevier B.V. All rights reserved.
WOS关键词CU/FE/CU/SI(111) ULTRATHIN FILMS ; COMPUTER-SIMULATION ; COPPER CLUSTERS ; MAGNETIC-PROPERTIES ; BEAM DEPOSITION ; CONTACT EPITAXY ; THIN-FILMS ; MULTILAYERS ; SUBSTRATE ; GROWTH
资助项目National Natural Science Foundation of China[91026002]
WOS研究方向Chemistry ; Materials Science ; Physics
语种英语
WOS记录号WOS:000341464100058
出版者ELSEVIER SCIENCE BV
源URL[http://119.78.100.186/handle/113462/50017]  
专题近代物理研究所_先进核能材料研究室（ADS）
通讯作者Li, Gongping
作者单位1.Chinese Acad Sci, Shanghai Inst Appl Phys, Div Nucl Mat Sci & Engn, Shanghai 207800, Peoples R China
2.Lanzhou Univ, Sch Nucl Sci & Technol, Lanzhou 730000, Peoples R China
3.Chinese Acad Sci, Inst Modern Phys, Lab Adv Nucl Mat, Lanzhou 730000, Peoples R China
推荐引用方式
GB/T 7714		 Zhang, Shixu,Gong, Hengfeng,Chen, Xuanzhi,et al. Low energy Cu clusters slow deposition on a Fe (001) surface investigated by molecular dynamics simulation[J]. APPLIED SURFACE SCIENCE,2014,314:433-442.
APA Zhang, Shixu,Gong, Hengfeng,Chen, Xuanzhi,Li, Gongping,&Wang, Zhiguang.(2014).Low energy Cu clusters slow deposition on a Fe (001) surface investigated by molecular dynamics simulation.APPLIED SURFACE SCIENCE,314,433-442.
MLA Zhang, Shixu,et al."Low energy Cu clusters slow deposition on a Fe (001) surface investigated by molecular dynamics simulation".APPLIED SURFACE SCIENCE 314(2014):433-442.

入库方式： OAI收割

来源：近代物理研究所

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