Thermal effect on endurance performance for 3-dimensional RRAM crossbar array
文献类型：期刊论文
| 作者 | Lu ND(卢年端) ; Sun PX(孙鹏霄); Liu Q(刘琦); Lv HB(吕杭炳); Long SB(龙世兵); Liu M(刘明)
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| 刊名 | Chinese Physics B
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| 出版日期 | 2016-04-05 |
| 文献子类 | 期刊论文 |
| 英文摘要 | In this work, the endurance performance of the 3D 1D1R crossbar array under the thermal effect is investigated in terms of numerical simulation. It is revealed that the endurance performance of the 3D 1D1R array would be seriously deteriorated under thermal effects as the feature size scales down to a relatively small value.A possible method to alleviate the thermal effects is provided and verified by numerical simulation. |
| 源URL | [http://159.226.55.106/handle/172511/16247]  |
| 专题 | 微电子研究所_微电子器件与集成技术重点实验室 |
| 作者单位 | 中国科学院微电子研究所 |
| 推荐引用方式 GB/T 7714 | Lu ND,Sun PX,Liu Q,et al. Thermal effect on endurance performance for 3-dimensional RRAM crossbar array[J]. Chinese Physics B,2016. |
| APA | Lu ND,Sun PX,Liu Q,Lv HB,Long SB,&Liu M.(2016).Thermal effect on endurance performance for 3-dimensional RRAM crossbar array.Chinese Physics B. |
| MLA | Lu ND,et al."Thermal effect on endurance performance for 3-dimensional RRAM crossbar array".Chinese Physics B (2016). |
入库方式： OAI收割
来源：微电子研究所
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