A new analytical electro-thermal model in 3D resistive switching memory arrays
文献类型：期刊论文
| 作者 | Lu ND(卢年端) ; Zong ZW(宗旨威); Liu Q(刘琦); Ji ZY(姬濯宇); Liu M(刘明)
|
| 刊名 | SCIENTIA SINICA Physica, Mechanica & Astronomica
 |
| 出版日期 | 2016-07-18 |
| 文献子类 | 期刊论文 |
| 英文摘要 | We present a new electro-thermal compact model for 3D RRAM arrays. The proposed model is based on the electro-thermal analogy which can couple thermal network to its electrical schematic. The comparison between the compact model simulation results and numerical simulation shows a good accuracy. This proposed model can be used to predict temperature distribution and analyze thermal crosstalk in 3D RRAM arrays. Our work will provide a reliable technical support for the late circuit design. |
| 源URL | [http://159.226.55.106/handle/172511/16248]  |
| 专题 | 微电子研究所_微电子器件与集成技术重点实验室 |
| 作者单位 | 中国科学院微电子研究所 |
| 推荐引用方式 GB/T 7714 | Lu ND,Zong ZW,Liu Q,et al. A new analytical electro-thermal model in 3D resistive switching memory arrays[J]. SCIENTIA SINICA Physica, Mechanica & Astronomica,2016. |
| APA | Lu ND,Zong ZW,Liu Q,Ji ZY,&Liu M.(2016).A new analytical electro-thermal model in 3D resistive switching memory arrays.SCIENTIA SINICA Physica, Mechanica & Astronomica. |
| MLA | Lu ND,et al."A new analytical electro-thermal model in 3D resistive switching memory arrays".SCIENTIA SINICA Physica, Mechanica & Astronomica (2016). |
入库方式： OAI收割
来源：微电子研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。