Effect of Non-Ionic Surfactant on Chemical Mechanical Planarization Performance in Alkaline Copper Slurry
文献类型：期刊论文
| 作者 | Chen L(陈岚); Cao H(曹鹤); Xu QZ(徐勤志); Yang F(杨飞) |
| 刊名 | INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING
 |
| 出版日期 | 2018-11-13 |
| 文献子类 | 期刊论文 |
| 源URL | [http://159.226.55.107/handle/172511/19039]  |
| 专题 | 微电子研究所_EDA中心 |
| 推荐引用方式 GB/T 7714 | Chen L,Cao H,Xu QZ,et al. Effect of Non-Ionic Surfactant on Chemical Mechanical Planarization Performance in Alkaline Copper Slurry[J]. INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING,2018. |
| APA | 陈岚,曹鹤,徐勤志,&杨飞.(2018).Effect of Non-Ionic Surfactant on Chemical Mechanical Planarization Performance in Alkaline Copper Slurry.INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING. |
| MLA | 陈岚,et al."Effect of Non-Ionic Surfactant on Chemical Mechanical Planarization Performance in Alkaline Copper Slurry".INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING (2018). |
入库方式： OAI收割
来源：微电子研究所
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