A wet etching approach for the via-reveal of a wafer with through silicon vias
文献类型：期刊论文
| 作者 | Xiao F(肖斐); Song CS(宋崇申); Wang L(王磊); Cao LQ(曹立强); Zhang WQ(张文奇); Wang J(王珺) |
| 刊名 | Microelectronic Engineering
 |
| 出版日期 | 2017-04-22 |
| 文献子类 | 期刊论文 |
| 源URL | [http://159.226.55.106/handle/172511/17961]  |
| 专题 | 微电子研究所_系统封装与集成研发中心 |
| 推荐引用方式 GB/T 7714 | Xiao F,Song CS,Wang L,et al. A wet etching approach for the via-reveal of a wafer with through silicon vias[J]. Microelectronic Engineering,2017. |
| APA | 肖斐,宋崇申,王磊,曹立强,张文奇,&王珺.(2017).A wet etching approach for the via-reveal of a wafer with through silicon vias.Microelectronic Engineering. |
| MLA | 肖斐,et al."A wet etching approach for the via-reveal of a wafer with through silicon vias".Microelectronic Engineering (2017). |
入库方式： OAI收割
来源：微电子研究所
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