Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package
文献类型：期刊论文
| 作者 | Liu FM(刘丰满); Cao LQ(曹立强); Hou FZ(侯峰泽) |
| 刊名 | IEEE Transactions on Components Packaging and Manufacturing Technology
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| 出版日期 | 2017-10-05 |
| 文献子类 | 期刊论文 |
| 源URL | [http://159.226.55.106/handle/172511/17962]  |
| 专题 | 微电子研究所_系统封装与集成研发中心 |
| 推荐引用方式 GB/T 7714 | Liu FM,Cao LQ,Hou FZ. Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package[J]. IEEE Transactions on Components Packaging and Manufacturing Technology,2017. |
| APA | 刘丰满,曹立强,&侯峰泽.(2017).Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package.IEEE Transactions on Components Packaging and Manufacturing Technology. |
| MLA | 刘丰满,et al."Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package".IEEE Transactions on Components Packaging and Manufacturing Technology (2017). |
入库方式： OAI收割
来源：微电子研究所
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