Experimental and Numerical Study of 3D Stacked Dies under Forced Air Cooling and Water Immersion
文献类型：期刊论文
| 作者 | Qiu DL(邱德龙); Hou FZ(侯峰泽); Wang QD(王启东); Cao LQ(曹立强) |
| 刊名 | Microelectronics Reliability
 |
| 出版日期 | 2017-07-01 |
| 文献子类 | 期刊论文 |
| 源URL | [http://159.226.55.106/handle/172511/17978]  |
| 专题 | 微电子研究所_系统封装与集成研发中心 |
| 推荐引用方式 GB/T 7714 | Qiu DL,Hou FZ,Wang QD,et al. Experimental and Numerical Study of 3D Stacked Dies under Forced Air Cooling and Water Immersion[J]. Microelectronics Reliability,2017. |
| APA | 邱德龙,侯峰泽,王启东,&曹立强.(2017).Experimental and Numerical Study of 3D Stacked Dies under Forced Air Cooling and Water Immersion.Microelectronics Reliability. |
| MLA | 邱德龙,et al."Experimental and Numerical Study of 3D Stacked Dies under Forced Air Cooling and Water Immersion".Microelectronics Reliability (2017). |
入库方式： OAI收割
来源：微电子研究所
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