Investigation of intermetallic compound and voids growth in fine-pitch Sn–3.5Ag/Ni/Cu microbumps
文献类型：期刊论文
| 作者 | Cao LQ(曹立强); Dai FW(戴风伟) |
| 刊名 | Journal of Materials SCIence: Materials in Electronics
 |
| 出版日期 | 2017-11-07 |
| 文献子类 | 期刊论文 |
| 源URL | [http://159.226.55.106/handle/172511/17979]  |
| 专题 | 微电子研究所_系统封装与集成研发中心 |
| 推荐引用方式 GB/T 7714 | Cao LQ,Dai FW. Investigation of intermetallic compound and voids growth in fine-pitch Sn–3.5Ag/Ni/Cu microbumps[J]. Journal of Materials SCIence: Materials in Electronics,2017. |
| APA | 曹立强,&戴风伟.(2017).Investigation of intermetallic compound and voids growth in fine-pitch Sn–3.5Ag/Ni/Cu microbumps.Journal of Materials SCIence: Materials in Electronics. |
| MLA | 曹立强,et al."Investigation of intermetallic compound and voids growth in fine-pitch Sn–3.5Ag/Ni/Cu microbumps".Journal of Materials SCIence: Materials in Electronics (2017). |
入库方式： OAI收割
来源：微电子研究所
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